Inventor · disambiguated record
Hijiri Hayashi
Also filed as: HAYASHI HIJIRI
12 granted patents·1 pending application·88 citations·filing 1989–2020
90Inventor score
Files withSHINKAWA KK13
Top patents by PatentIndex Score
13 records- 0160US11302666B2Mounting headSHINKAWA KK·Filed 2017·Granted Apr 12, 2022·1 cites·12 claims
- 0250US6070778AWire bonding apparatus and control method thereofSHINKAWA KK·Filed 1998·Granted Jun 6, 2000·14 cites·2 claims
- 0349US5016803AWire bonding apparatusSHINKAWA KK·Filed 1989·Granted May 21, 1991·15 cites·3 claims
- 0447US6206266B1Control method for wire bonding apparatusSHINKAWA KK·Filed 1998·Granted Mar 27, 2001·12 cites·1 claims
- 0547US5046654AUltrasonic wire bonding apparatusSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·13 cites·2 claims
- 0646US6362014B1Bonding apparatusSHINKAWA KK·Filed 2000·Granted Mar 26, 2002·2 cites·3 claims
- 0746US2022320034A1Mounting apparatusSHINKAWA KK·Filed 2020·Application pending·0 cites
- 0845US6119917AWire bonding apparatus and bonding load correction method for the sameSHINKAWA KK·Filed 1998·Granted Sep 19, 2000·13 cites·2 claims
- 0940US6095396ABonding load correction method and wire bonding apparatusSHINKAWA KK·Filed 1998·Granted Aug 1, 2000·8 cites·1 claims
- 1032US5949208ACircuit and method for controlling a DC motorSHINKAWA KK·Filed 1998·Granted Sep 7, 1999·4 cites·3 claims
- 1131US6302312B1Bonding apparatus and methodSHINKAWA KK·Filed 1999·Granted Oct 16, 2001·2 cites·1 claims
- 1231US6119914AWire bonding apparatusSHINKAWA KK·Filed 1999·Granted Sep 19, 2000·2 cites·2 claims
- 1329US5485063AMotor control circuit for a wire bonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 16, 1996·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →