Inventor · disambiguated record
Hideki Higashitani
Also filed as: HIGASHITANI HIDEKI
16 granted patents·5 pending applications·283 citations·filing 1999–2011
94Inventor score
Top patents by PatentIndex Score
21 records- 0195US6197407B1Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 6, 2001·107 cites·13 claims
- 0292US7247508B2Semiconductor device with intermediate connectorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 24, 2007·24 cites·13 claims
- 0388US6748652B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 15, 2004·32 cites·2 claims
- 0483US6532651B1Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 18, 2003·29 cites·25 claims
- 0579US7132029B2Multilayer circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 7, 2006·7 cites·34 claims
- 0677US7291915B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 6, 2007·10 cites·4 claims
- 0775US6565954B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 20, 2003·17 cites·8 claims
- 0871US7018705B2Multilayer circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·12 cites·5 claims
- 0970US7968803B2Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substratePANASONIC CORP·Filed 2006·Granted Jun 28, 2011·4 cites·13 claims
- 1070US7252891B2Wiring transfer sheet and method for producing the same, and wiring board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 7, 2007·10 cites·14 claims
- 1169US6946205B2Wiring transfer sheet and method for producing the same, and wiring board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 20, 2005·9 cites·34 claims
- 1261US6546624B2Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 15, 2003·8 cites·18 claims
- 1360US6745464B2Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 8, 2004·7 cites·8 claims
- 1456US6926789B2Wiring transfer sheet and method for producing the same, and wiring board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 9, 2005·4 cites·29 claims
- 1553US7200927B2Method for producing a wiring transfer sheetMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 10, 2007·3 cites·6 claims
- 1647US2010224395A1Multilayer wiring board and its manufacturing methodPANASONIC CORP·Filed 2007·Application pending·0 cites
- 1743US8071881B2Wiring board, method for manufacturing same and semiconductor deviceHIGASHITANI HIDEKI·Filed 2005·Granted Dec 6, 2011·0 cites·15 claims
- 1842US2013062101A1Multilayer wiring substrate, and manufacturing method for multilayer substrateKANAI TOSHINOBU·Filed 2011·Application pending·0 cites
- 1938US2013168148A1Multilayer printed wiring board and method of manufacturing sameKANAI TOSHINOBU·Filed 2011·Application pending·0 cites
- 2038US2004156177A1Package of electronic components and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2138US2002180029A1Semiconductor device with intermediate connectorFiled 2002·Application pending·0 cites
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