Inventor · disambiguated record
Hiroaki Himi
Also filed as: HIMI HIROAKI
18 granted patents·2 pending applications·722 citations·filing 1992–2007
95Inventor score
Top patents by PatentIndex Score
20 records- 0194US5488243ASOI MOSFET with floating gateNIPPON DENSO CO·Filed 1993·Granted Jan 30, 1996·133 cites·10 claims
- 0292US5525824ASemiconductor device with isolation regionsNIPPON DENSO CO·Filed 1994·Granted Jun 11, 1996·100 cites·16 claims
- 0384US6064158AElectroluminescent display deviceDENSO CORP·Filed 1998·Granted May 16, 2000·61 cites·8 claims
- 0484US5847516AElectroluminescent display driver deviceNIPPON DENSO CO·Filed 1996·Granted Dec 8, 1998·65 cites·12 claims
- 0584US5777365ASemiconductor device having a silicon-on-insulator structureNIPPON DENSO CO·Filed 1996·Granted Jul 7, 1998·75 cites·19 claims
- 0682US7239181B2Semiconductor deviceDENSO CORP·Filed 2005·Granted Jul 3, 2007·12 cites·22 claims
- 0782US5451547AMethod of manufacturing semiconductor substrateNIPPON DENSO CO·Filed 1992·Granted Sep 19, 1995·89 cites·9 claims
- 0880US6676748B1Method for manufacturing semiconductor substrateDENSO CORP·Filed 2000·Granted Jan 13, 2004·20 cites·16 claims
- 0978US5874768ASemiconductor device having a high breakdown voltageNIPPON DENSO CO·Filed 1997·Granted Feb 23, 1999·43 cites·39 claims
- 1077US5851846APolishing method for SOINIPPON DENSO CO·Filed 1995·Granted Dec 22, 1998·57 cites·24 claims
- 1172US6465839B2Semiconductor device having lateral MOSFET (LDMOS)DENSO CORP·Filed 2001·Granted Oct 15, 2002·15 cites·16 claims
- 1267US5650354AMethod for producing semiconductor deviceNIPPON DENSO CO·Filed 1996·Granted Jul 22, 1997·31 cites·15 claims
- 1361US6573144B2Method for manufacturing a semiconductor device having lateral MOSFET (LDMOS)Filed 2002·Granted Jun 3, 2003·8 cites·11 claims
- 1458US6768183B2Semiconductor device having bipolar transistorsDENSO CORP·Filed 2002·Granted Jul 27, 2004·8 cites·55 claims
- 1555US7132347B2Semiconductor device with trench structure and method for manufacturing the sameDENSO CORP·Filed 2003·Granted Nov 7, 2006·5 cites·16 claims
- 1653US7754580B2Method for manufacturing semiconductor substrateDENSO CORP·Filed 2007·Granted Jul 13, 2010·0 cites·1 claims
- 1749US7838909B2Semiconductor device with trench structureDENSO CORP·Filed 2006·Granted Nov 23, 2010·0 cites·20 claims
- 1842US7220654B2Method for manufacturing semiconductor substrateDENSO CORP·Filed 2003·Granted May 22, 2007·0 cites·5 claims
- 1942US2008099862A1Physical quantity sensor and method for manufacturing the sameDENSO CORP·Filed 2007·Application pending·0 cites
- 2039US2006231868A1Semiconductor device for high voltage ICDENSO CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →