Inventor · disambiguated record
Hiroyuki Hiramoto
Also filed as: HIRAMOTO HIROYUKI
4 granted patents·1 pending application·265 citations·filing 1998–2007
82Inventor score
Technology areasH10W
Files withTOSHIBA KK5
Top patents by PatentIndex Score
5 records- 0192US6201696B1Package for semiconductor power device and method for assembling the sameTOSHIBA KK·Filed 1998·Granted Mar 13, 2001·156 cites·12 claims
- 0291US6597063B1Package for semiconductor power device and method for assembling the sameTOSHIBA KK·Filed 2000·Granted Jul 22, 2003·83 cites·21 claims
- 0356US6605868B2Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layerTOSHIBA KK·Filed 1999·Granted Aug 12, 2003·20 cites·18 claims
- 0454US7263766B2Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrateTOSHIBA KK·Filed 2003·Granted Sep 4, 2007·6 cites·1 claims
- 0538US2009237890A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →