Inventor · disambiguated record
Hiroyuki Hishida
Also filed as: HISHIDA HIROYUKI
9 granted patents·5 pending applications·7 citations·filing 2014–2023
76Inventor score
Top patents by PatentIndex Score
14 records- 0176US9824435B2Image analyzing apparatus and programIHI CORP·Filed 2014·Granted Nov 21, 2017·5 cites·10 claims
- 0266US9811898B2Image analyzing apparatus and programIHI CORP·Filed 2014·Granted Nov 7, 2017·2 cites·8 claims
- 0364US2025382742A1Napped artificial leather and manufacturing method thereforKURARAY CO·Filed 2023·Application pending·0 cites
- 0460US12325952B2Napped artificial leather and method for producing the sameKURARAY CO·Filed 2020·Granted Jun 10, 2025·0 cites·18 claims
- 0560US2025027269A1Napped artificial leather and method for producing napped artificial leatherKURARAY CO·Filed 2022·Application pending·0 cites
- 0653US11339531B2Dyed leather-like sheet and fiber structureKURARAY CO·Filed 2017·Granted May 24, 2022·0 cites·6 claims
- 0752US12043956B2Napped artificial leatherKURARAY CO·Filed 2019·Granted Jul 23, 2024·0 cites·11 claims
- 0847US2022018061A1Napped artificial leather and method for producing the sameKURARAY CO·Filed 2019·Application pending·0 cites
- 0943US2020263351A1Napped artificial leatherKURARAY CO·Filed 2018·Application pending·0 cites
- 1042US10132778B2Fiber waviness detection method and apparatus for conductive composite materialsIHI CORP·Filed 2016·Granted Nov 20, 2018·0 cites·3 claims
- 1142US10068349B2Image analysis apparatus, image analysis method, and programIHI CORP·Filed 2015·Granted Sep 4, 2018·0 cites·16 claims
- 1241US10745832B2Material shape simulation apparatus, material shape simulation method, and three-dimensional woven fiber component manufacturing methodIHI CORP·Filed 2018·Granted Aug 18, 2020·0 cites·10 claims
- 1339US2020048828A1Leather-like sheet and fiber structureKURARAY CO·Filed 2018·Application pending·0 cites
- 1434US10650173B2Support apparatus, design support method, and programIHI CORP·Filed 2015·Granted May 12, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →