Inventor · disambiguated record
Hirokazu Honkawa
Also filed as: HONKAWA HIROKAZU
6 granted patents·146 citations·filing 1996–2005
85Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD6
Top patents by PatentIndex Score
6 records- 0185US5727311AMethod and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Mar 17, 1998·67 cites·16 claims
- 0280US7165318B2Components placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 23, 2007·8 cites·4 claims
- 0377US6725532B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 27, 2004·38 cites·27 claims
- 0455US6976304B2Components placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 20, 2005·5 cites·10 claims
- 0555US6178621B1Electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 30, 2001·18 cites·4 claims
- 0644US5850689AMethod and apparatus for supporting printed boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Dec 22, 1998·10 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →