Inventor · disambiguated record
Hirofumi Ichikawa
Also filed as: ICHIKAWA HIROFUMI
21 granted patents·1 pending application·183 citations·filing 2004–2024
95Inventor score
Top patents by PatentIndex Score
22 records- 0198US11094854B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2020·Granted Aug 17, 2021·7 cites·27 claims
- 0297US10573788B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2018·Granted Feb 25, 2020·7 cites·31 claims
- 0397US10573789B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2018·Granted Feb 25, 2020·7 cites·21 claims
- 0497US9537071B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2015·Granted Jan 3, 2017·13 cites·26 claims
- 0597US9490411B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2015·Granted Nov 8, 2016·13 cites·24 claims
- 0696US10115870B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2016·Granted Oct 30, 2018·7 cites·27 claims
- 0796US9287476B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2013·Granted Mar 15, 2016·13 cites·21 claims
- 0895US10700241B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2018·Granted Jun 30, 2020·7 cites·27 claims
- 0995US8530250B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyICHIKAWA HIROFUMI·Filed 2009·Granted Sep 10, 2013·32 cites·32 claims
- 1092US2025133878A1Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2024·Application pending·0 cites
- 1191US9893250B1Light emitting device having silicone resin-based sealing memberNICHIA CORP·Filed 2016·Granted Feb 13, 2018·11 cites·15 claims
- 1282US9397276B2Light emitting device and resin compositionNICHIA CORP·Filed 2015·Granted Jul 19, 2016·4 cites·17 claims
- 1381US9559274B2Light emitting device and resin compositionNICHIA CORP·Filed 2016·Granted Jan 31, 2017·4 cites·21 claims
- 1479US9472735B2Light-emitting deviceNICHIA CORP·Filed 2016·Granted Oct 18, 2016·4 cites·16 claims
- 1579USD691105SHeadphonesITO REIKO·Filed 2012·Granted Oct 8, 2013·29 cites·1 claims
- 1677US12211959B2Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded bodyNICHIA CORP·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 1775USD690681SHeadphonesITO REIKO·Filed 2012·Granted Oct 1, 2013·24 cites·1 claims
- 1865US12507513B2Method for manufacturing light-emitting device, and light-emitting deviceNICHIA CORP·Filed 2023·Granted Dec 23, 2025·0 cites·12 claims
- 1952US9653662B2Light emitting deviceNICHIA CORP·Filed 2014·Granted May 16, 2017·0 cites·30 claims
- 2051US8426879B2Light emitting device and backlight unit using the sameKITANI MOTOHISA·Filed 2006·Granted Apr 23, 2013·1 cites·13 claims
- 2148US9960326B2Light emitting deviceNICHIA CORP·Filed 2017·Granted May 1, 2018·0 cites·21 claims
- 2231US7632424B2Method for inhibiting the discoloration of methylenebisaniline compoundsIHARA CHEMICAL IND CO·Filed 2004·Granted Dec 15, 2009·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →