Inventor · disambiguated record
Hideo Ichimura
Also filed as: ICHIMURA HIDEO
10 granted patents·2 pending applications·209 citations·filing 1997–2021
90Inventor score
Files withMITSUBISHI ELECTRIC CORP8ICHIMURA HIDEO1MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1MATSUSHITA ELECTRONICS CORP1TOWER PARTNERS SEMICONDUCTOR CO LTD1
Top patents by PatentIndex Score
12 records- 0193US7585355B2Temperature/humidity exchangerMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Sep 8, 2009·20 cites·7 claims
- 0293US6482544B1Battery packageMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 19, 2002·59 cites·3 claims
- 0387US7404848B2Humidifier and a method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jul 29, 2008·12 cites·15 claims
- 0484US7311760B2Temperature-humidity exchangerMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Dec 25, 2007·10 cites·7 claims
- 0578US6007673AApparatus and method of producing an electronic deviceMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Dec 28, 1999·60 cites·19 claims
- 0674US7115233B2ReformerMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Oct 3, 2006·14 cites·16 claims
- 0769US7224014B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 29, 2007·15 cites·16 claims
- 0860US7785406B2Apparatus for volatile organic compound treatment and method of volatile organic compound treatmentMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Aug 31, 2010·1 cites·16 claims
- 0949US6485862B1Thin battery and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Nov 26, 2002·18 cites·7 claims
- 1043US7316734B2Volatile organic compound treatment apparatusMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Jan 8, 2008·0 cites·9 claims
- 1143US2021320204A1Semiconductor device and method for producing sameTOWER PARTNERS SEMICONDUCTOR CO LTD·Filed 2021·Application pending·0 cites
- 1243US2008001250A1Semiconductor device and fabrication method thereforICHIMURA HIDEO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →