Inventor · disambiguated record
Hiroyuki Iguchi
Also filed as: IGUCHI HIROYUKI
18 granted patents·18 pending applications·149 citations·filing 1988–2025
91Inventor score
Top patents by PatentIndex Score
36 records- 0189US4878942ABenzamide derivative, process for its production and plant growth regulantHODOGAYA CHEMICAL CO LTD·Filed 1988·Granted Nov 7, 1989·57 cites·4 claims
- 0286US6988862B1Rivet, riveted joint structure riveting apparatus, and riveting methodTOYOTA MOTOR CO LTD·Filed 2000·Granted Jan 24, 2006·53 cites·6 claims
- 0382US10253139B2Addition-curable silicone resin composition and a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 9, 2019·1 cites·5 claims
- 0481US10040924B2Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2016·Granted Aug 7, 2018·1 cites·11 claims
- 0577US6663146B1Single flare tube and joint structure of single flare tubeTOYOTA MOTOR CO LTD·Filed 2000·Granted Dec 16, 2003·28 cites·21 claims
- 0677US2022267526A1Maleimide resin film and composition for maleimide resin filmSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0772US10556993B2Addition-curable organopolysiloxane resin composition, cured product thereof, and semiconductor device having the cured productSHINETSU CHEMICAL CO·Filed 2018·Granted Feb 11, 2020·2 cites·6 claims
- 0871US2025084205A1Resin compositionSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0969US2024182646A1Bismaleimide compound, resin varnish, and production method thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1069US2021061955A1Maleimide resin film and composition for maleimide resin filmSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1166US2023130867A1Cyclic imide resin composition, liquid adhesive, film, prepreg, copper-clad laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1264US2023140237A1Heat-curable maleimide resin composition, film, prepreg, laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1364US2023143093A1Heat-curable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1463US12421435B2Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing sameSHINETSU CHEMICAL CO·Filed 2022·Granted Sep 23, 2025·0 cites·14 claims
- 1562US2023040536A1Photocurable maleimide resin compositionSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1661US10696794B2Addition-curable silicone resin composition and a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 30, 2020·0 cites·5 claims
- 1759US2025296294A1Copper foil with resin, and copper-clad laminate and printed wiring board using the sameSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 1858US11326056B2Radiation curable organosilicon resin compositionSHINETSU CHEMICAL CO·Filed 2019·Granted May 10, 2022·0 cites·10 claims
- 1956US11608438B2Low-dielectric heat dissipation film composition and low-dielectric heat dissipation filmSHINETSU CHEMICAL CO·Filed 2020·Granted Mar 21, 2023·0 cites·10 claims
- 2056US2021079219A1Maleimide resin composition and maleimide resin filmSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2155US12146057B2Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2021·Granted Nov 19, 2024·0 cites·16 claims
- 2255US11530324B2Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured productSHINETSU CHEMICAL CO·Filed 2020·Granted Dec 20, 2022·0 cites·7 claims
- 2355US2024117120A1Curable resin composition for bonding film, bonding film, and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2455US2020156291A1Anisotropic film and method for manufacturing anisotropic filmSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 2555US2021017337A1Aromatic bismaleimide compound, production method thereof, and heat-curable cyclic imide resin composition containing the compoundSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2654US2021054152A1Heat-curable resin composition, and adhesive agent, film, prepreg, laminate, circuit board and printed-wiring board using sameSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2753US2023416466A1Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring boardSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2852US2020131316A1(meth)acryloyl group-containing organosiloxaneSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 2951US10818618B2Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrateSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 3051US4902815APlant growth regulantHODOGAYA CHEMICAL CO LTD·Filed 1988·Granted Feb 20, 1990·4 cites·2 claims
- 3143US9859474B2Addition curable organopolysiloxane composition, and semiconductor packageSHINETSU CHEMICAL CO·Filed 2016·Granted Jan 2, 2018·0 cites·5 claims
- 3242US5043006ABenzamide derivatives and plant growth regulants containing themHODOGAYA CHEMICAL CO LTD·Filed 1989·Granted Aug 27, 1991·2 cites·3 claims
- 3340US2019100663A1Anisotropic conductive film and method for manufacturing anisotropic conductive filmSHINETSU CHEMICAL CO·Filed 2018·Application pending·0 cites
- 3438US2004068854A1Self-piercing rivetFiled 2003·Application pending·0 cites
- 3534US5227511ABenzamide derivatives and plant growth regulants containing themHODOGAYA CHEMICAL CO LTD·Filed 1991·Granted Jul 13, 1993·1 cites·22 claims
- 3631US4976768APlant growth regulantHODOGAYA CHEMICAL CO LTD·Filed 1989·Granted Dec 11, 1990·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →