Inventor · disambiguated record
Hironobu Ikeda
Also filed as: IKEDA HIRONOBU
16 granted patents·2 pending applications·326 citations·filing 1992–2024
93Inventor score
Top patents by PatentIndex Score
18 records- 0192US6518666B1Circuit board reducing a warp and a method of mounting an integrated circuit chipNEC CORP·Filed 2000·Granted Feb 11, 2003·60 cites·8 claims
- 0288US7755895B2Heat sink, an electronic component package, and a method of manufacturing a heat sinkNEC CORP·Filed 2006·Granted Jul 13, 2010·18 cites·17 claims
- 0385US2024371542A1Conductor, conductive composition and laminateMITSUBISHI CHEM CORP·Filed 2024·Application pending·0 cites
- 0481US5285351ACooling structure for integrated circuitsNEC CORP·Filed 1992·Granted Feb 8, 1994·67 cites·9 claims
- 0574US12073956B2Conductor, conductive composition and laminateMITSUBISHI CHEM CORP·Filed 2021·Granted Aug 27, 2024·0 cites·6 claims
- 0674US6087716ASemiconductor device package having a connection substrate with turned back leads and method thereofNEC CORP·Filed 1998·Granted Jul 11, 2000·48 cites·11 claims
- 0774US5973930AMounting structure for one or more semiconductor devicesNEC CORP·Filed 1998·Granted Oct 26, 1999·49 cites·9 claims
- 0870US5436501ACooling structure for integrated circuitNEC CORP·Filed 1993·Granted Jul 25, 1995·44 cites·13 claims
- 0964US11145432B2Conductor, conductive composition and laminateMITSUBISHI CHEM CORP·Filed 2018·Granted Oct 12, 2021·0 cites·1 claims
- 1064US10643976B2Electronic component, and electronic component manufacturing methodNEC CORP·Filed 2018·Granted May 5, 2020·1 cites·11 claims
- 1163US10096395B2Conductor, conductive composition and laminateMITSUBISHI CHEM CORP·Filed 2013·Granted Oct 9, 2018·0 cites·8 claims
- 1260US6271480B1Electronic deviceNEC CORP·Filed 1998·Granted Aug 7, 2001·27 cites·11 claims
- 1355US7896658B2Apparatus and method for adjusting position of electronic componentNEC CORP·Filed 2008·Granted Mar 1, 2011·2 cites·15 claims
- 1450US10870929B2Polypropylene fiber and method for manufacturing polypropylene fiberMITSUBISHI CHEM CORP·Filed 2016·Granted Dec 22, 2020·0 cites·19 claims
- 1546US2019153626A1Polyolefin fiber and method for producing sameMITSUBISHI CHEM CORP·Filed 2019·Application pending·0 cites
- 1645US7671477B2Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic componentNEC CORP·Filed 2006·Granted Mar 2, 2010·1 cites·18 claims
- 1743US10334721B2Electronic component and electronic component manufacturing methodNEC CORP·Filed 2018·Granted Jun 25, 2019·0 cites·12 claims
- 1841US6285553B1Mounting structure for an LSINEC CORP·Filed 1999·Granted Sep 4, 2001·9 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →