Inventor · disambiguated record
Hironori Ikeno
Also filed as: IKENO HIRONORI
2 granted patents·3 pending applications·0 citations·filing 2010–2021
21Inventor score
Top patents by PatentIndex Score
5 records- 0147US2024150525A1Thermosetting resin composition, organosilicon compound, molded body, and optical semiconductor deviceJNC CORP·Filed 2021·Application pending·0 cites
- 0238US2019375896A1Silsesquioxane derivative having radical polymerizable functional group, composition thereof, and cured film having low cure shrinkageJNC CORP·Filed 2018·Application pending·0 cites
- 0336US2019185711A1Epoxy resin composition and cured resin film with low curing shrinkage and excellent adhesionJNC CORP·Filed 2016·Application pending·0 cites
- 0435US12384888B2Condensation-curable resin composition, cured product, molded body, and semiconductor deviceJNC CORP·Filed 2019·Granted Aug 12, 2025·0 cites·14 claims
- 0527US9753186B2Glass fiber-silsesquioxane composite molded article and method for producing sameIKENO HIRONORI·Filed 2010·Granted Sep 5, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →