Inventor · disambiguated record
Hirokazu Imai
Also filed as: IMAI HIROKAZU
12 granted patents·8 pending applications·87 citations·filing 1999–2023
89Inventor score
Top patents by PatentIndex Score
20 records- 0195US11328655B2Drive device and display apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted May 10, 2022·15 cites·19 claims
- 0284US8605284B2Measurement device and measurement methodTORIUMI YOICHI·Filed 2011·Granted Dec 10, 2013·6 cites·22 claims
- 0380US6239694B1Warning device for filter-changing timeDENSO CORP·Filed 2000·Granted May 29, 2001·25 cites·15 claims
- 0476US7357883B2Conductive adhesive, method of producing the same, and bonding methodDENSO CORP·Filed 2006·Granted Apr 15, 2008·3 cites·7 claims
- 0573US7276185B2Conductor composition, a mounting substrate and a mounting structure utilizing the compositionDENSO CORP·Filed 2004·Granted Oct 2, 2007·17 cites·6 claims
- 0669US7340908B2Refrigerant cycle device for vehicleDENSO CORP·Filed 2005·Granted Mar 11, 2008·3 cites·20 claims
- 0766US2016362333A1D1499 radiation curable resin compositionDSM IP ASSETS BV·Filed 2016·Application pending·0 cites
- 0859US9402559B2Input device and calibration methodSONY CORP·Filed 2012·Granted Aug 2, 2016·1 cites·9 claims
- 0958US2014241687A1D1499 radiation curable resin compositionDSM IP ASSETS BV·Filed 2014·Application pending·0 cites
- 1056US2012321270A1D1499 radiation curable resin compositionIMAI HIROKAZU·Filed 2010·Application pending·0 cites
- 1156US2016326410A1Sealer for sealing covered-wireJSR CORP·Filed 2014·Application pending·0 cites
- 1254US2025324840A1Display apparatusSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 1349US7807073B2Conductor composition, a mounting substrate and a mounting structure utilizing the compositionDENSO CORP·Filed 2007·Granted Oct 5, 2010·0 cites·12 claims
- 1448US8651699B2Flexible substrate, mounting method of flexible substrate, and lighting systemKAWABE HIDEO·Filed 2011·Granted Feb 18, 2014·0 cites·15 claims
- 1548US6731001B2Semiconductor device including bonded wire based to electronic part and method for manufacturing the sameDENSO CORP·Filed 2001·Granted May 4, 2004·3 cites·31 claims
- 1647US9566005B2Measuring apparatus, measuring method, and parameter setting methodTORIUMI YOICHI·Filed 2012·Granted Feb 14, 2017·0 cites·12 claims
- 1747US6326239B1Mounting structure of electronic parts and mounting method of electronic partsDENSO CORP·Filed 1999·Granted Dec 4, 2001·14 cites·12 claims
- 1843US2013035568A1Information processing apparatus, information processing method, program, and information processing systemSONY CORP·Filed 2012·Application pending·0 cites
- 1940US2011180938A1Electronic device and method of manufacturing the sameDENSO CORP·Filed 2011·Application pending·0 cites
- 2037US2013199818A1Radiation curable resin composition for electrical wireUCHIDA HIROFUMI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →