Inventor · disambiguated record
Hideo Imai
Also filed as: IMAI HIDEO · ISHIMATSU YOSHIKAZU
27 granted patents·9 pending applications·112 citations·filing 1978–2019
95Inventor score
Top patents by PatentIndex Score
36 records- 0190US10030362B2Cabin of working machine, working machine having cabin, and method for manufacturing cabinKUBOTA KK·Filed 2015·Granted Jul 24, 2018·7 cites·5 claims
- 0288US8303026B2Cabin unit for work machineYAMASHITA YUJI·Filed 2011·Granted Nov 6, 2012·16 cites·4 claims
- 0387US9828744B2Working machineKUBOTA KK·Filed 2016·Granted Nov 28, 2017·5 cites·13 claims
- 0485US9209112B2Semiconductor device having stacked substrates with protruding and recessed electrode connectionSEIKO EPSON CORP·Filed 2014·Granted Dec 8, 2015·6 cites·8 claims
- 0583US9567729B2Working machineKUBOTA KK·Filed 2015·Granted Feb 14, 2017·4 cites·17 claims
- 0679US9863828B2Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile objectSEIKO EPSON CORP·Filed 2015·Granted Jan 9, 2018·3 cites·19 claims
- 0779US7957693B2Wireless relay amplification apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted Jun 7, 2011·7 cites·5 claims
- 0878US10344452B2Cabin of working machine and working machine having cabinKUBOTA KK·Filed 2018·Granted Jul 9, 2019·2 cites·8 claims
- 0977US7474525B2Electronic deviceCASIO COMPUTER CO LTD·Filed 2007·Granted Jan 6, 2009·9 cites·6 claims
- 1075US7676913B2Wiring board, method of manufacturing wiring board, and electronic deviceSEIKO EPSON CORP·Filed 2008·Granted Mar 16, 2010·5 cites·5 claims
- 1167US7790595B2Manufacturing method improving the reliability of a bump electrodeSEIKO EPSON CORP·Filed 2006·Granted Sep 7, 2010·4 cites·2 claims
- 1264US8174110B2Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuitIMAI HIDEO·Filed 2008·Granted May 8, 2012·2 cites·5 claims
- 1364US7936073B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2010·Granted May 3, 2011·1 cites·10 claims
- 1463USD748563SCabin for construction equipmentKUBOTA KK·Filed 2014·Granted Feb 2, 2016·11 cites·1 claims
- 1563US7825518B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2010·Granted Nov 2, 2010·1 cites·10 claims
- 1660US7671476B2Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2006·Granted Mar 2, 2010·1 cites·10 claims
- 1759US9000575B2Semiconductor device having stacked substrates with protruding and recessed electrode connectionIMAI HIDEO·Filed 2012·Granted Apr 7, 2015·1 cites·14 claims
- 1859US4194229AMode selecting assembly for recording and/or reproducing apparatusSONY CORP·Filed 1978·Granted Mar 18, 1980·9 cites·18 claims
- 1953US10260213B2Working machineKUBOTA KK·Filed 2017·Granted Apr 16, 2019·0 cites·14 claims
- 2052US7528487B2Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring boardSEIKO EPSON CORP·Filed 2004·Granted May 5, 2009·5 cites·10 claims
- 2151US9519131B2Electronic device and electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Dec 13, 2016·0 cites·9 claims
- 2251US9309043B2Optical element storage package, optical filter device, optical module, and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Apr 12, 2016·0 cites·19 claims
- 2349US2006005994A1Wiring board, method of manufacturing wiring board, and electronic deviceSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 2448US10747093B2Joined body, method for producing joined body, and projectorSEIKO EPSON CORP·Filed 2019·Granted Aug 18, 2020·0 cites·7 claims
- 2548US4411181AFully automatic apparatus for producing an electrical cord of a predetermined length with a plug attached theretoKAWASAKI ELECTRIC WIRE·Filed 1981·Granted Oct 25, 1983·10 cites·10 claims
- 2647US9664581B2Pressure sensor, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted May 30, 2017·0 cites·14 claims
- 2746US2015092274A1Optical filter device, optical module, electronic device, and mems deviceSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 2846US2014192412A1Package, optical module, and electronic apparatusSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 2946US2015062708A1Optical device, optical module, electronic apparatus, optical housing, and method of manufacturing optical housingSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 3042US2007007666A1Substrate for manufacturing semiconductor device, semiconductor device manufacturing methodSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3142US2014204461A1Optical device storage package, optical filter device, optical module, and electronic apparatusSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 3241US2005212130A1Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipmentIMAI HIDEO·Filed 2005·Application pending·0 cites
- 3341US2006240664A1Method of manufacturing multi-layered substrateWADA KENJI·Filed 2006·Application pending·0 cites
- 3440US8027389B2Interface circuitPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·0 cites·4 claims
- 3533US4406604AApparatus for orienting terminal blades attached to a wire for producing an electrical cord therefromKAWASAKI ELECTRIC WIRE·Filed 1981·Granted Sep 27, 1983·3 cites·9 claims
- 3633US2005235177A1Path delay test methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →