Inventor · disambiguated record
Hideyuki Inotsume
Also filed as: INOTSUME HIDEYUKI
7 granted patents·10 citations·filing 2002–2019
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0158US11735497B2Integrated passive device and fabrication method using a last through-substrate viaSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 0251US10535585B2Integrated passive device and fabrication method using a last through-substrate viaSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 14, 2020·0 cites·18 claims
- 0351US6833616B2Multilayer wiring board with mounting padSANYO ELECTRIC CO·Filed 2002·Granted Dec 21, 2004·5 cites·17 claims
- 0446US6833608B2Semiconductor device and packaging system thereforeSANYO ELECTRIC CO·Filed 2002·Granted Dec 21, 2004·3 cites·19 claims
- 0545US6818969B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2002·Granted Nov 16, 2004·2 cites·16 claims
- 0644US7554183B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2007·Granted Jun 30, 2009·0 cites·6 claims
- 0742US7535087B2Semiconductor device with lead framesSANYO ELECTRIC CO·Filed 2007·Granted May 19, 2009·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →