Inventor · disambiguated record
Hiroko Inoue
Also filed as: INOUE HIROKO
3 granted patents·2 pending applications·6 citations·filing 2003–2020
55Inventor score
Top patents by PatentIndex Score
5 records- 0153US6943431B2Semiconductor device using low-k material as interlayer insulating film and including a surface modifying layerFUJITSU LTD·Filed 2003·Granted Sep 13, 2005·6 cites·3 claims
- 0248US10611876B2Epoxy-amine adduct, thermoplastic resin composition, sizing agent, sizing agent coated carbon fiber, and fiber-reinforced composite materialDAICEL CORP·Filed 2014·Granted Apr 7, 2020·0 cites·30 claims
- 0341US12509432B2Alicyclic epoxy compound productDAICEL CORP·Filed 2020·Granted Dec 30, 2025·0 cites·16 claims
- 0437US2006087041A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 0535US2015291728A1Epoxy compound, production method therefor, and curable epoxy resin compositionDAICEL CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →