Inventor · disambiguated record
Hidetoshi Inoue
Also filed as: INOUE HIDETOSHI
29 granted patents·16 pending applications·579 citations·filing 1986–2024
96Inventor score
Top patents by PatentIndex Score
45 records- 0189US5886408AMulti-chip semiconductor deviceFUJITSU LTD·Filed 1997·Granted Mar 23, 1999·126 cites·6 claims
- 0288US7438991B2Nonaqueous electrolyte secondary cell and method for charging sameSANYO ELECTRIC CO·Filed 2005·Granted Oct 21, 2008·10 cites·19 claims
- 0387US6406923B1Process for reclaiming wafer substratesKOBE PREC INC·Filed 2000·Granted Jun 18, 2002·45 cites·7 claims
- 0485US8385051B2Electrode structure, capacitor, battery, and method for manufacturing electrode structureTOYO ALUMINIUM KK·Filed 2010·Granted Feb 26, 2013·5 cites·7 claims
- 0583US5855735AProcess for recovering substratesKOBE PRECISION INC·Filed 1995·Granted Jan 5, 1999·77 cites·30 claims
- 0680US6395250B2Lithium/nickel/cobalt composite oxide, process for preparing the same, and cathode active material for rechargeable batteryFUJI CHEM IND CO LTD·Filed 1997·Granted May 28, 2002·42 cites·2 claims
- 0779US9164082B2Biochip substrate and method for producing sameINOUE HIDETOSHI·Filed 2012·Granted Oct 20, 2015·8 cites·13 claims
- 0878US9219277B2Low Co hydrogen storage alloyMITSUI MINING & SMELTING CO·Filed 2013·Granted Dec 22, 2015·1 cites·2 claims
- 0978US6143590AMulti-chip semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Nov 7, 2000·51 cites·3 claims
- 1075US5805666AMethod of and apparatus for diagnosing personal communication systemSONY CORP·Filed 1996·Granted Sep 8, 1998·80 cites·16 claims
- 1174US6451696B1Method for reclaiming wafer substrate and polishing solution compositions thereforKOBE STEEL LTD·Filed 1999·Granted Sep 17, 2002·44 cites·15 claims
- 1269US7960837B2Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 14, 2011·4 cites·7 claims
- 1367US12365783B2Compound, molded article, and cured productSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jul 22, 2025·0 cites·19 claims
- 1466US11848441B2Zinc foil, primary battery negative electrode active material using same, and zinc foil production methodMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Dec 19, 2023·0 cites·10 claims
- 1563US6325988B1Process for preparing spinel type lithium manganese composite oxide and cathode active material for rechargeable batteryFUJI CHEM IND CO LTD·Filed 1998·Granted Dec 4, 2001·36 cites·8 claims
- 1662US8976509B2Aluminum materialTOYO ALUMINIUM KK·Filed 2014·Granted Mar 10, 2015·0 cites·10 claims
- 1761US2024347267A1Power module with flat copper windingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1858US5021890AMethod of and apparatus for facsimile communicationsOKI ELECTRIC IND CO LTD·Filed 1989·Granted Jun 4, 1991·15 cites·7 claims
- 1958US2025279401A1Integrated module having a thermal networkTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2057US8223521B2Inverter deviceINOUE HIDETOSHI·Filed 2009·Granted Jul 17, 2012·5 cites·2 claims
- 2157US4822414AAl-based alloy comprising Cr and TiKOBE STEEL LTD·Filed 1987·Granted Apr 18, 1989·14 cites·6 claims
- 2257US2025081476A1Integrated circuit with inductor in magnetic packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2357US2025006575A1Semiconductor package with covered magnetic mold compoundTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2454US2025140769A1Integrated circuit package with integrated heat sinkTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2554US2025273524A1Insulation for magnetic-molding compound (mmc) moduleTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2653US12084774B2Gas wiping nozzle and method for manufacturing hot-dip metal coated metal stripJFE STEEL CORP·Filed 2021·Granted Sep 10, 2024·0 cites·17 claims
- 2753US11655532B2Gas wiping nozzle and method of manufacturing hot-dip metal coated metal stripJFE STEEL CORP·Filed 2019·Granted May 23, 2023·0 cites·14 claims
- 2853US2024006392A1Integrated circuit with inductor in magnetic packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2953US2023125587A1Zinc foil, battery negative electrode active material using same, and zinc foil production methodMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 3051US9899681B2Positive electrode for secondary batteries, secondary battery, and method for producing positive electrode for secondary batteriesTOYO ALUMINIUM KK·Filed 2013·Granted Feb 20, 2018·0 cites·7 claims
- 3151US2024006259A1Integrated circuit with inductor in magnetic packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3250US4782528ATelephone apparatusOKI ELECTRIC IND CO LTD·Filed 1986·Granted Nov 1, 1988·14 cites·6 claims
- 3349US9976163B2Method for preventing reduction of polypeptide by adding amino acid to culture solutionKYOWA HAKKO KIRIN CO LTD·Filed 2013·Granted May 22, 2018·0 cites·10 claims
- 3449US8535460B2Low Co hydrogen storage alloyMUKAI DAISUKE·Filed 2004·Granted Sep 17, 2013·2 cites·7 claims
- 3549US2022244638A1Conductive patterning using a permanent resistTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3648US7314594B2Hydrogen storage alloyMITSUI MINING & SMELTING CO·Filed 2003·Granted Jan 1, 2008·0 cites·6 claims
- 3746US9608275B2Electrically conductive layer coated aluminum material and method for manufacturing the sameINOUE HIDETOSHI·Filed 2011·Granted Mar 28, 2017·0 cites·11 claims
- 3845US2023111102A1Method for producing the variable domain of the heavy chain of a heavy-chain antibodyKAO CORP·Filed 2020·Application pending·0 cites
- 3945US2008153203A1Semiconductor device manufacturing methodSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 4041US12454612B2Liquid resin composition for compression molding and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 28, 2025·0 cites·10 claims
- 4141US2011027537A1Carbon-coated aluminum material and method for manufacturing the sameINOUE HIDETOSHI·Filed 2009·Application pending·0 cites
- 4240US2012261162A1Method for manufacturing electrode structure, electrode structure, and capacitorNAKAYAMA KUNIHIKO·Filed 2011·Application pending·0 cites
- 4338US12131970B2Liquid resin composition for sealing and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 29, 2024·0 cites·20 claims
- 4437US2011318550A1Electrically conductive substance coated aluminum material and method for manufacturing the sameINOUE HIDETOSHI·Filed 2010·Application pending·0 cites
- 4535US2021206906A1Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →