Inventor · disambiguated record
Hiroshi Ise
Also filed as: ISE HIROSHI
10 granted patents·161 citations·filing 1988–2012
89Inventor score
Files withNEC CORP3UCHIDA SHINICHI3JAPAN SYNTHETIC RUBBER CO LTD2HONDA MOTOR CO LTD1YUGEN KAISHA GUNMA KAKOH SEIZO1
Top patents by PatentIndex Score
10 records- 0185US4892351AWater drain trough for automotive sunroofHONDA MOTOR CO LTD·Filed 1988·Granted Jan 9, 1990·55 cites·10 claims
- 0284US5093426AHydrogenated copolymer rubber, rubber composition comprising said rubber and rubber product obtained from the rubberJAPAN SYNTHETIC RUBBER CO LTD·Filed 1989·Granted Mar 3, 1992·35 cites·13 claims
- 0369US8193038B2Method for manufacturing semiconductor device, semiconductor chip, and semiconductor waferUCHIDA SHINICHI·Filed 2010·Granted Jun 5, 2012·2 cites·9 claims
- 0462US5356283AMetal mold for sealing semiconductor devices with a resinNEC CORP·Filed 1993·Granted Oct 18, 1994·22 cites·1 claims
- 0562US4912186AAcrylic rubber, acrylic rubber composition and cured rubber article thereofJAPAN SYNTHETIC RUBBER CO LTD·Filed 1988·Granted Mar 27, 1990·14 cites·24 claims
- 0651US8581368B2Method for manufacturing semiconductor device, semiconductor chip, and semiconductor waferUCHIDA SHINICHI·Filed 2012·Granted Nov 12, 2013·0 cites·7 claims
- 0751US6180435B1Semiconductor device with economical compact package and process for fabricating semiconductor deviceNEC CORP·Filed 1999·Granted Jan 30, 2001·19 cites·13 claims
- 0846US4997457AColored flame solid fuel and methodYUGEN KAISHA GUNMA KAKOH SEIZO·Filed 1990·Granted Mar 5, 1991·13 cites·11 claims
- 0939US8158505B2Method for manufacturing a semiconductor device, semiconductor chip and semiconductor waferUCHIDA SHINICHI·Filed 2010·Granted Apr 17, 2012·0 cites·11 claims
- 1029US6491857B2Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used thereinNEC CORP·Filed 1998·Granted Dec 10, 2002·1 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →