Inventor · disambiguated record
Hisao Ishikawa
Also filed as: ISHIKAWA HISAO
9 granted patents·235 citations·filing 1978–2023
87Inventor score
Files withOJI PAPER CO3ISHIKAWA TECH LABORATORY CO LTD2YAMASHITA NOBUO2ISHIKAWA HISAO1NIPPON JOINT CO LTD1
Top patents by PatentIndex Score
9 records- 0193US4225381AMethod for removing odor from fluidOJI PAPER CO·Filed 1978·Granted Sep 30, 1980·54 cites·2 claims
- 0290US5269470AMethod of producing finely divided fibrous cellulose particlesOJI PAPER CO·Filed 1992·Granted Dec 14, 1993·95 cites·9 claims
- 0387US6133170ALow density bodyOJI PAPER CO·Filed 1998·Granted Oct 17, 2000·75 cites·19 claims
- 0483US8676PPink dogwood "Benifuji"YAMASHITA NOBUO·Filed 1992·Granted Apr 5, 1994·3 cites·1 claims
- 0579US8138576B2Production method and production apparatus of tin or solder alloy for electronic components, and solder alloyISHIKAWA HISAO·Filed 2009·Granted Mar 20, 2012·5 cites·10 claims
- 0667US12392015B2Printed wiring board, printed circuit board, and electronic componentISHIKAWA TECH LABORATORY CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·3 claims
- 0764US8675PWhite dogwood Tsukuba-No-MineYAMASHITA NOBUO·Filed 1992·Granted Apr 5, 1994·1 cites·1 claims
- 0861US8011562B2Soldering equipment and soldering method for electronic componentsNIPPON JOINT CO LTD·Filed 2009·Granted Sep 6, 2011·2 cites·4 claims
- 0960US11802322B2Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive memberISHIKAWA TECH LABORATORY CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →