Inventor · disambiguated record
Hikaru Iwai
Also filed as: IWAI HIKARU
10 granted patents·7 pending applications·5 citations·filing 2006–2025
79Inventor score
Top patents by PatentIndex Score
17 records- 0181US11802017B2Ultrasonic apparatus, detection apparatus, and printing apparatusSEIKO EPSON CORP·Filed 2020·Granted Oct 31, 2023·1 cites·15 claims
- 0278US2025385472A1Electrical connectorHIROSE ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 0374US11180333B2Ultrasonic deviceSEIKO EPSON CORP·Filed 2019·Granted Nov 23, 2021·1 cites·10 claims
- 0471US10605915B2Ultrasonic device, ultrasonic module, electronic apparatus, and ultrasonic measurement apparatusSEIKO EPSON CORP·Filed 2016·Granted Mar 31, 2020·2 cites·1 claims
- 0562US12433570B2Ultrasound probeSEIKO EPSON CORP·Filed 2024·Granted Oct 7, 2025·0 cites·6 claims
- 0660US11806753B2Ultrasonic device and manufacturing method of ultrasonic deviceSEIKO EPSON CORP·Filed 2020·Granted Nov 7, 2023·0 cites·4 claims
- 0759US10203404B2Ultrasonic sensor and manufacturing method for the sameSEIKO EPSON CORP·Filed 2016·Granted Feb 12, 2019·1 cites·19 claims
- 0857US2024364818A1Ultrasonic apparatusSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 0957US2025051117A1Medium transport device and image reading deviceSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 1056US2024324997A1Ultrasonic ProbeSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 1153US2023329121A1Electronic deviceSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1252US2023041175A1Ultrasonic Device And Ultrasonic Diagnostic ApparatusSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
- 1349US12438993B2Ultrasonic deviceSEIKO EPSON CORP·Filed 2022·Granted Oct 7, 2025·0 cites·13 claims
- 1449US11371865B2Sensor unit and electronic deviceSEIKO EPSON CORP·Filed 2019·Granted Jun 28, 2022·0 cites·6 claims
- 1544US11018291B2Ultrasonic device and ultrasonic apparatusSEIKO EPSON CORP·Filed 2017·Granted May 25, 2021·0 cites·14 claims
- 1643US11910720B2Piezoelectric device and MEMS deviceSEIKO EPSON CORP·Filed 2020·Granted Feb 20, 2024·0 cites·13 claims
- 1736US2006286692A1Method for manufacturing semiconductor element, apparatus for manufacturing semiconductor element and semiconductor elementNAGAWA MICHIFUMI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →