Inventor · disambiguated record

Hiroyasu Iwama

Also filed as: IWAMA HIROYASU

2 granted patents·90 citations·filing 2000–2000

66Inventor score

Technology areasC09J H05K

Files withDENSO CORP2

Top patents by PatentIndex Score

2 records

0191US6449836B1Method for interconnecting printed circuit boards and interconnection structureDENSO CORP·Filed 2000·Granted Sep 17, 2002·78 cites·29 claims
0273US6605357B1Bonding method and bonding structure of thermoplastic resin materialDENSO CORP·Filed 2000·Granted Aug 12, 2003·12 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →