Inventor · disambiguated record
Hitoshi Kajino
Also filed as: KAJINO HITOSHI
5 granted patents·5 pending applications·15 citations·filing 2001–2020
71Inventor score
Top patents by PatentIndex Score
10 records- 0164US7601442B2Jig for calcining electronic componentMITSUI MINING & SMELTING CO·Filed 2008·Granted Oct 13, 2009·3 cites·14 claims
- 0261US6403875B1Process for producing thermoelectric materialMITSUI MINING & SMELTING CO·Filed 2001·Granted Jun 11, 2002·12 cites·6 claims
- 0358US11034622B2Rare earth oxyfluoride sintered body and method for producing sameMITSUI MINING & SMELTING CO·Filed 2017·Granted Jun 15, 2021·0 cites·12 claims
- 0458US2020407280A1Rare Earth Oxyfluoride Sintered Body And Method For Producing SameMITSUI MINING & SMELTING CO·Filed 2020·Application pending·0 cites
- 0546US12024435B2Sintered metal carbide and heat-resistant member for silicon carbide semiconductor manufacturing device comprising sameMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·10 claims
- 0643US2009314525A1Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole FormationMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0739US7704612B2Jig for electronic part firingMITSUI MINING & SMELTING CO·Filed 2005·Granted Apr 27, 2010·0 cites·5 claims
- 0834US2005252446A1Electronic component burning jigMITSUI MINING & SMELTING CO·Filed 2003·Application pending·0 cites
- 0933US2018168004A1Heater Tube for Molten Metal ImmersionMITSUI MINING & SMELTING CO·Filed 2017·Application pending·0 cites
- 1030US2005257740A1Electronic component burning jigMITSUI MINING & SMELTING CO·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hitoshi Kajino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →