Inventor · disambiguated record
Hiromichi Kawakami
Also filed as: KAWAKAMI HIROMICHI
25 granted patents·4 pending applications·210 citations·filing 1996–2019
96Inventor score
Top patents by PatentIndex Score
29 records- 0189US6426551B1Composite monolithic electronic componentMURATA MANUFACTURING CO·Filed 2001·Granted Jul 30, 2002·35 cites·16 claims
- 0287US11067600B2Multilayer circuit board used for probe card and probe card including multilayer circuit boardMURATA MANUFACTURING CO·Filed 2018·Granted Jul 20, 2021·5 cites·13 claims
- 0384US7569177B2Method of producing ceramic multilayer substrates, and green composite laminateMURATA MANUFACTURING CO·Filed 2005·Granted Aug 4, 2009·10 cites·19 claims
- 0479US6938332B2Method for manufacturing multilayer ceramic substratesMURATA MANUFACTURING CO·Filed 2002·Granted Sep 6, 2005·31 cites·18 claims
- 0576US6444598B1Insulator composition, insulator paste and laminated electronic partMURATA MANUFACTURING CO·Filed 2000·Granted Sep 3, 2002·14 cites·16 claims
- 0675US10499506B2Composite substrate and method for manufacturing composite substrateMURATA MANUFACTURING CO·Filed 2018·Granted Dec 3, 2019·2 cites·19 claims
- 0770US6365265B1Photosensitive insulating paste and thick-film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2000·Granted Apr 2, 2002·14 cites·18 claims
- 0869US8231961B2Low temperature co-fired ceramic material, low temperature co-fired ceramic body, and multilayer ceramic substrateYOKOYAMA TOMOYA·Filed 2010·Granted Jul 31, 2012·4 cites·10 claims
- 0966US7001569B2Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated bodyMURATA MANUFACTURING CO·Filed 2001·Granted Feb 21, 2006·9 cites·20 claims
- 1059US10638603B2Multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 1156US10485099B2Multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2018·Granted Nov 19, 2019·0 cites·17 claims
- 1255US6596382B2Multilayered board and method for fabricating the sameMURATA MANUFACTURING CO·Filed 2001·Granted Jul 22, 2003·5 cites·7 claims
- 1355US6534161B1Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the sameMURATA MANUFACTURING CO·Filed 2000·Granted Mar 18, 2003·5 cites·9 claims
- 1454US6403694B1Photosensitive insulating paste and thick film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2000·Granted Jun 11, 2002·4 cites·11 claims
- 1554US5766741AInsulating paste and thick-film multi-layered printed circuit using the pasteMURATA MANUFACTURING CO·Filed 1996·Granted Jun 16, 1998·16 cites·6 claims
- 1654US2009321121A1Ceramic multilayer substrate and its manufacturing methodMURATA MANUFACTURING CO·Filed 2009·Application pending·0 cites
- 1750US2007256859A1Ceramic multilayer substrate and its manufacturing methodMURATA MANUFACTURING CO·Filed 2007·Application pending·0 cites
- 1849US6942833B2Ceramic multilayer substrate manufacturing method and unfired composite multilayer bodyMURATA MANUFACTURING CO·Filed 2003·Granted Sep 13, 2005·4 cites·20 claims
- 1947US6602946B2Photosensitive insulating paste and thick film multi-layer circuit substrateMURATA MANUFACTURING CO·Filed 2001·Granted Aug 5, 2003·1 cites·17 claims
- 2047US5814571ADielectric paste and thick-film capacitor using sameMURATA MANUFACTURING CO·Filed 1996·Granted Sep 29, 1998·11 cites·12 claims
- 2147US5710082AGlass composition having a low dielectric constant for high-frequency circuitsMURATA MANUFACTURING CO·Filed 1996·Granted Jan 20, 1998·13 cites·15 claims
- 2241US5702996AInsulation paste containing glassMURATA MANUFACTURING CO·Filed 1996·Granted Dec 30, 1997·9 cites·20 claims
- 2338US6316374B1Dielectric ceramic composition and ceramic electronic element produced from the sameMURATA MANUFACTURING CO·Filed 1999·Granted Nov 13, 2001·5 cites·1 claims
- 2438US2019191565A1Electronic device and multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2019·Application pending·0 cites
- 2537US6270880B1Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit boardMURATA MANUFACTURING CO·Filed 1999·Granted Aug 7, 2001·6 cites·23 claims
- 2635US5968858AInsulating paste and thick-film multi-layered printed circuit using the pasteMURATA MANUFACTURING CO·Filed 1997·Granted Oct 19, 1999·4 cites·3 claims
- 2732US6007900ADielectric paste and thick-film capacitor using sameMURATA MANUFACTURING CO·Filed 1998·Granted Dec 28, 1999·2 cites·12 claims
- 2831US6118649ADielectric paste and thick film capacitor using the sameMURATA MANUFACTURING CO·Filed 1998·Granted Sep 12, 2000·1 cites·20 claims
- 2930US2002034614A1Multilayer board and method for making the sameMURATA MANUFACTURING CO·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →