Inventor · disambiguated record
Hirokazu Kawamura
Also filed as: KAWAMURA HIROKAZU
5 granted patents·5 pending applications·17 citations·filing 2001–2017
71Inventor score
Top patents by PatentIndex Score
10 records- 0167US10605453B2Conduit and hot water supply systemNORITZ CORP·Filed 2017·Granted Mar 31, 2020·1 cites·9 claims
- 0262USD816820SExhaust pipe for water heaterTOSETZ CO LTD·Filed 2015·Granted May 1, 2018·11 cites·1 claims
- 0345US2006220242A1Method for producing flexible printed wiring board, and flexible printed wiring boardMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0443US2009044971A1Printed Wiring Board, Process for Producing the Same and Usage of the SameMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0541US2009183901A1Wiring Boards and Processes for Manufacturing the SameMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0635US6798048B22-Metal layer TAB tape and both-sided CSP•BGA tapeMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 28, 2004·0 cites·14 claims
- 0733US8414033B2Pipe joint and pipe equipped with pipe jointKAWAMURA HIROKAZU·Filed 2012·Granted Apr 9, 2013·0 cites·8 claims
- 0832US2004026122A1Printed circuit board and production method therefor, and laminated printed circuit boardFiled 2002·Application pending·0 cites
- 0930US2004099441A1Printed circuit board,its manufacturing method and csp manufacturing methodFiled 2002·Application pending·0 cites
- 1029USD720056SExhaust pipe cover for water heaterMAKI NORIKAZU·Filed 2012·Granted Dec 23, 2014·5 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →