Inventor · disambiguated record
Hideo Kawano
Also filed as: KAWANO HIDEO · KUBOTERA KIKUO
26 granted patents·1 pending application·754 citations·filing 1971–2012
97Inventor score
Top patents by PatentIndex Score
27 records- 0196US5835177AArray substrate with bus lines takeout/terminal sections having multiple conductive layersTOSHIBA KK·Filed 1996·Granted Nov 10, 1998·186 cites·4 claims
- 0293US6078366AArray substrate comprising semiconductor contact layers having same outline as signal linesTOSHIBA KK·Filed 1998·Granted Jun 20, 2000·91 cites·6 claims
- 0389US5966190AArray substrate for displaying device with capacitor lines having particular connectionsTOSHIBA KK·Filed 1998·Granted Oct 12, 1999·63 cites·4 claims
- 0489US5646705AElectrode structure of liquid crystal display device and method of manufacturing the liquid crystal display deviceTOSHIBA KK·Filed 1995·Granted Jul 8, 1997·119 cites·27 claims
- 0583US6028652AArray substrate for display device and manufacturing method thereofTOSHIBA KK·Filed 1998·Granted Feb 22, 2000·43 cites·10 claims
- 0680US6985194B2Matrix array substrateTOSHIBA KK·Filed 2001·Granted Jan 10, 2006·33 cites·6 claims
- 0778US5677745ALCD with electrostatic discharge projectionsTOSHIBA KK·Filed 1995·Granted Oct 14, 1997·55 cites·14 claims
- 0870US6337726B1Array substrate for liquid crystal display elementTOSHIBA KK·Filed 1999·Granted Jan 8, 2002·41 cites·9 claims
- 0965US5543347AMethod of forming silicon film having jagged surfaceNEC CORP·Filed 1994·Granted Aug 6, 1996·24 cites·27 claims
- 1063US6864868B2Control device of a liquid crystal display deviceTOSHIBA KK·Filed 2002·Granted Mar 8, 2005·8 cites·7 claims
- 1160US7602453B2Display deviceINFO VISION OPTOELECTRONICS HO·Filed 2007·Granted Oct 13, 2009·2 cites·8 claims
- 1256US7598525B2Thin film transistor array substrate with multiple chamfers and liquid crystal display deviceINFO VISION OPTOELECTRONICS HO·Filed 2007·Granted Oct 6, 2009·1 cites·6 claims
- 1356US5065402ATransverse-mode stabilized laser diodeNEC CORP·Filed 1991·Granted Nov 12, 1991·16 cites·6 claims
- 1456US4148971AFlame spraying materials and process for producing the sameHITACHI CABLE·Filed 1977·Granted Apr 10, 1979·15 cites·14 claims
- 1552US6380591B1Electrode wiring board subjected to counter measure against static electricity and display device using the sameTOSHIBA KK·Filed 1998·Granted Apr 30, 2002·19 cites·7 claims
- 1652US5858853AMethod for forming capacitor electrode having jagged surfaceNEC CORP·Filed 1995·Granted Jan 12, 1999·14 cites·40 claims
- 1746US4138871ALiquid pressure extrusion method and device for tube or tubular memberHITACHI CABLE·Filed 1977·Granted Feb 13, 1979·5 cites·26 claims
- 1844US8054436B2Substrate for display device and display deviceINFOVISION OPTOELECTRONICS HOLDINGS LTD·Filed 2007·Granted Nov 8, 2011·0 cites·9 claims
- 1941US2008164524A1Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the sameINFOVISION OPTOELECTRONICS HOL·Filed 2007·Application pending·0 cites
- 2040US9244315B2Active matrix display deviceKAWANO HIDEO·Filed 2012·Granted Jan 26, 2016·0 cites·24 claims
- 2137US4434491ASemiconductor laserNIPPON ELECTRIC CO·Filed 1981·Granted Feb 28, 1984·5 cites·8 claims
- 2234US6362447B2Electrode wire for electrical discharge machining apparatusHITACHI CABLE·Filed 1999·Granted Mar 26, 2002·5 cites·2 claims
- 2333US5596591AGain-guided type laser diodeNEC CORP·Filed 1994·Granted Jan 21, 1997·3 cites·1 claims
- 2433US3976487APhotosensitive printing plateFUJI PHOTO FILM CO LTD·Filed 1971·Granted Aug 24, 1976·3 cites·2 claims
- 2528US6250536B1Method for manufacturing electrode wire for electrical discharge machining apparatusHITACHI CABLE·Filed 1999·Granted Jun 26, 2001·1 cites·4 claims
- 2627US4217408APrinting plate materialFUJI PHOTO FILM CO LTD·Filed 1976·Granted Aug 12, 1980·2 cites·28 claims
- 2726US8633038B2Manufacturing method of semiconductor integrated circuit deviceKAWANO HIDEO·Filed 2012·Granted Jan 21, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →