Inventor · disambiguated record
Hidenori Kinbara
Also filed as: KINBARA HIDENORI
7 granted patents·251 citations·filing 1981–1995
89Inventor score
Files withMITSUBISHI GAS CHEMICAL CO7
Top patents by PatentIndex Score
7 records- 0192US4917758AMethod for preparing thin copper foil-clad substrate for circuit boardsMITSUBISHI GAS CHEMICAL CO·Filed 1989·Granted Apr 17, 1990·61 cites·16 claims
- 0289US4383903ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted May 17, 1983·55 cites·7 claims
- 0380US4871811AHot melt adhesive compositionMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Oct 3, 1989·40 cites·7 claims
- 0479US4937132ALaminating material for printed circuit board of low dielectric constantMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Jun 26, 1990·35 cites·18 claims
- 0576US4820769AHot melt adhesive compositionMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 11, 1989·21 cites·5 claims
- 0665US5480269AMethod of drilling a hole for printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 1994·Granted Jan 2, 1996·25 cites·4 claims
- 0752US5692940ASheet material for laminate of printed circuit and laminate for printed circuit using the sameMITSUBISHI GAS CHEMICAL CO·Filed 1995·Granted Dec 2, 1997·14 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →