Inventor · disambiguated record
Hideki Kiritani
Also filed as: KIRITANI HIDEKI
5 granted patents·12 citations·filing 2013–2017
72Inventor score
Files withMITSUBISHI CHEM CORP5
Top patents by PatentIndex Score
5 records- 0182US9508648B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2013·Granted Nov 29, 2016·6 cites·24 claims
- 0279US9847298B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2016·Granted Dec 19, 2017·3 cites·11 claims
- 0374US9822294B2Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2014·Granted Nov 21, 2017·3 cites·24 claims
- 0453US10400151B2Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2017·Granted Sep 3, 2019·0 cites·21 claims
- 0533US10125289B2Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor deviceMITSUBISHI CHEM CORP·Filed 2015·Granted Nov 13, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →