Inventor · disambiguated record
Hiroaki Kodama
Also filed as: KODAMA HIROAKI
39 granted patents·5 pending applications·387 citations·filing 1983–2022
98Inventor score
Top patents by PatentIndex Score
44 records- 0193US7437030B2Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboardIBIDEN CO LTD·Filed 2006·Granted Oct 14, 2008·25 cites·9 claims
- 0290US8249402B2Multilayer printed circuit boardASAI MOTOO·Filed 2010·Granted Aug 21, 2012·12 cites·21 claims
- 0390US8078017B2Method for manufacturing optical interface module and optical interface moduleKODAMA HIROAKI·Filed 2009·Granted Dec 13, 2011·42 cites·20 claims
- 0489US8120040B2Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communicationASAI MOTOO·Filed 2010·Granted Feb 21, 2012·10 cites·30 claims
- 0589US7674987B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Mar 9, 2010·20 cites·36 claims
- 0688US10818428B1Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Oct 27, 2020·2 cites·20 claims
- 0788US7715666B2Optical path converting member, multilayer print circuit board, and device for optical communicationIBIDEN CO LTD·Filed 2008·Granted May 11, 2010·14 cites·25 claims
- 0888US7526152B2Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboardIBIDEN CO LTD·Filed 2007·Granted Apr 28, 2009·15 cites·17 claims
- 0986US11763975B2Inductor built-in substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2019·Granted Sep 19, 2023·2 cites·20 claims
- 1086US7315970B2Semiconductor device to improve data retention characteristics of DRAMSONY CORP·Filed 2005·Granted Jan 1, 2008·18 cites·15 claims
- 1185US7724989B2Optical/electrical composite wiring board and a manufacturing method thereofIBIDEN CO LTD·Filed 2008·Granted May 25, 2010·15 cites·9 claims
- 1284US7801398B2Optical path converting member, multilayer print circuit board, and device for optical communicationIBIDEN CO LTD·Filed 2008·Granted Sep 21, 2010·9 cites·21 claims
- 1384US7783141B2Substrate for mounting IC chip and device for optical communicationIBIDEN CO LTD·Filed 2007·Granted Aug 24, 2010·13 cites·35 claims
- 1483US7764860B2Optical path converting member, multilayer print circuit board, and device for optical communicationIBIDEN CO LTD·Filed 2007·Granted Jul 27, 2010·7 cites·26 claims
- 1582US7995880B2Optical path converting member, multilayer print circuit board, and device for optical communicationIBIDEN CO LTD·Filed 2010·Granted Aug 9, 2011·4 cites·21 claims
- 1681US7919849B2Package substrate and device for optical communicationIBIDEN CO LTD·Filed 2007·Granted Apr 5, 2011·9 cites·39 claims
- 1780US8076782B2Substrate for mounting IC chipASAI MOTOO·Filed 2003·Granted Dec 13, 2011·19 cites·7 claims
- 1877US8238700B2Multilayer printed circuit boardASAI MOTOO·Filed 2010·Granted Aug 7, 2012·3 cites·16 claims
- 1976US11887767B2Inductor built-in substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 2076US11749444B2Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Sep 5, 2023·1 cites·20 claims
- 2176US10388451B2Inductor component and method for manufacturing inductor componentIBIDEN CO LTD·Filed 2017·Granted Aug 20, 2019·1 cites·20 claims
- 2275US7907801B2Optical element, package substrate and device for optical communicationIBIDEN CO LTD·Filed 2007·Granted Mar 15, 2011·7 cites·33 claims
- 2375US7734125B2Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication deviceIBIDEN CO LTD·Filed 2008·Granted Jun 8, 2010·7 cites·22 claims
- 2474US7563947B2Plant cells and plant bodies with modified cell growth, development and differentiationISHIHARA SANGYO KAISHA·Filed 2004·Granted Jul 21, 2009·4 cites·1 claims
- 2574US4950031AAutomobile rear underbody structureMAZDA MOTOR·Filed 1988·Granted Aug 21, 1990·35 cites·30 claims
- 2665US7795018B2Monocyte-origin multipotent cell MOMCUNIV KEIO·Filed 2004·Granted Sep 14, 2010·4 cites·9 claims
- 2764US8311375B2Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication deviceKODAMA HIROAKI·Filed 2010·Granted Nov 13, 2012·2 cites·6 claims
- 2864US7187603B2Semiconductor memory device, repair search method, and self-repair methodSONY CORP·Filed 2004·Granted Mar 6, 2007·15 cites·24 claims
- 2962US7020033B2Semiconductor memory apparatus and self-repair methodSONY CORP·Filed 2004·Granted Mar 28, 2006·14 cites·13 claims
- 3058US5267772AStructure of rear body portion for an automotive vehicleMAZDA MOTOR·Filed 1992·Granted Dec 7, 1993·22 cites·16 claims
- 3157US7676123B2Optical and electrical circuit board and method of manufacturing the sameIBIDEN CO LTD·Filed 2008·Granted Mar 9, 2010·2 cites·9 claims
- 3254US4555799AMethod for inspecting crimp bonded terminalsSUMITOMO ELECTRIC INDUSTRIES·Filed 1983·Granted Nov 26, 1985·16 cites·8 claims
- 3353US11501909B2Inductor built-in substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·20 claims
- 3452US11521786B2Inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 3552US2009016671A1Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 3650US11782027B2Deterioration prediction device for magnetic body and deterioration prediction method for magnetic bodySHIMADZU CORP·Filed 2020·Granted Oct 10, 2023·0 cites·9 claims
- 3749US11322301B2Method for manufacturing inductor built-in substrateIBIDEN CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3849US2009227691A1Method for releasing molecule of interest based on target nucleic acid sequenceRIKEN·Filed 2008·Application pending·0 cites
- 3949US2007223935A1Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 4046US2009170205A1Method of maintenance and expansion of hematopoietic stem cellsRIKEN·Filed 2008·Application pending·0 cites
- 4145US11435316B2Magnetic body management system and magnetic body management methodSHIMADZU CORP·Filed 2018·Granted Sep 6, 2022·0 cites·11 claims
- 4241US2019364662A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2019·Application pending·0 cites
- 4339US7016242B2Semiconductor memory apparatus and self-repair methodSONY CORP·Filed 2004·Granted Mar 21, 2006·3 cites·13 claims
- 4438US5954579ADevice for automatically changing air directionDENSO CORP OF KARIYA·Filed 1997·Granted Sep 21, 1999·15 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →