Inventor · disambiguated record
Hideo Komo
Also filed as: KOMO Hideo
8 granted patents·5 pending applications·3 citations·filing 2013–2022
74Inventor score
Files withMITSUBISHI ELECTRIC CORP13
Top patents by PatentIndex Score
13 records- 0171US11152287B2Semiconductor module and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 19, 2021·2 cites·16 claims
- 0261US11854950B2Semiconductor module and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 26, 2023·0 cites·2 claims
- 0360US9508700B2Semiconductor device module with solder layerMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Nov 29, 2016·1 cites·9 claims
- 0452US2025316657A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0550US2025079271A1Semiconductor device, power converter, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0649US2025167079A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0748US2025359283A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0847US12463107B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 4, 2025·0 cites·15 claims
- 0947US2025167063A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1045US11621213B2Semiconductor device including a spring plateMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 4, 2023·0 cites·21 claims
- 1138US10734990B2Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 4, 2020·0 cites·14 claims
- 1238US10505518B2Semiconductor device with substrate temperature monitor circuitMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 10, 2019·0 cites·7 claims
- 1332US11764126B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 19, 2023·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →