Inventor · disambiguated record
Hirozumi Kon
Also filed as: KON HIROZUMI
14 granted patents·1 pending application·63 citations·filing 2004–2012
91Inventor score
Top patents by PatentIndex Score
15 records- 0179US7157821B2Electromagnetic actuatorKEIHIN CORP·Filed 2005·Granted Jan 2, 2007·7 cites·1 claims
- 0278US8919748B2Active antivibration device and manufacturing method for the sameURAYAMA ATSUSHI·Filed 2011·Granted Dec 30, 2014·10 cites·6 claims
- 0375US6972500B2Electromagnetic actuatorKEIHIN CORP·Filed 2004·Granted Dec 6, 2005·13 cites·7 claims
- 0472US8253524B2Coil winding system and method for fabricating molded coilNOMURA TOMOHIRO·Filed 2008·Granted Aug 28, 2012·6 cites·5 claims
- 0570US7348694B2Electromagnetic actuatorKEIHIN CORP·Filed 2005·Granted Mar 25, 2008·4 cites·3 claims
- 0667US7066454B2Active type vibration isolating support systemHONDA MOTOR CO LTD·Filed 2004·Granted Jun 27, 2006·12 cites·14 claims
- 0766US7679228B2Electromagnetic actuatorKEIHIN CORP·Filed 2008·Granted Mar 16, 2010·3 cites·4 claims
- 0860US7992848B2Active vibration isolation support systemKEIHIN CORP·Filed 2007·Granted Aug 9, 2011·2 cites·2 claims
- 0959US8616535B2Active vibration isolation support systemKON HIROZUMI·Filed 2008·Granted Dec 31, 2013·3 cites·2 claims
- 1059US7554429B2Electromagnetic actuatorKEIHIN CORP·Filed 2006·Granted Jun 30, 2009·2 cites·3 claims
- 1158US7923873B2Electromagnetic actuatorKEIHIN CORP·Filed 2010·Granted Apr 12, 2011·1 cites·1 claims
- 1253USRE41827EElectromagnetic actuatorKEIHIN CORP·Filed 2007·Granted Oct 19, 2010·0 cites·12 claims
- 1350US8534590B2Coil winding system and method for fabricating molded coilNOMURA TOMOHIRO·Filed 2012·Granted Sep 17, 2013·0 cites·7 claims
- 1450US8434213B2Method for fabricating molded coilNOMURA TOMOHIRO·Filed 2012·Granted May 7, 2013·0 cites·3 claims
- 1537US2010301530A1Fluid-filled type active vibration damping device and manufacturing method thereofTOKAI RUBBER IND LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →