Inventor · disambiguated record
Hiroe Kowada
Also filed as: KOWADA HIROE
4 granted patents·9 citations·filing 2009–2012
64Inventor score
Top patents by PatentIndex Score
4 records- 0171US8319108B2Mounting structure and electronic equipmentYAMAGUCHI ATSUSHI·Filed 2009·Granted Nov 27, 2012·5 cites·13 claims
- 0265US8344268B2Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the samePANASONIC CORP·Filed 2009·Granted Jan 1, 2013·4 cites·7 claims
- 0338US8664773B2Mounting structure of semiconductor package component and manufacturing method thereforYAMAGUCHI ATSUSHI·Filed 2012·Granted Mar 4, 2014·0 cites·4 claims
- 0434US8698005B2Package structure, method for manufacturing same, and method for repairing package structureKOWADA HIROE·Filed 2011·Granted Apr 15, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →