Inventor · disambiguated record
Hidetoshi Koyama
Also filed as: KOYAMA HIDETOSHI
10 granted patents·1 pending application·25 citations·filing 2007–2021
84Inventor score
Top patents by PatentIndex Score
11 records- 0179US9640647B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 2, 2017·3 cites·12 claims
- 0276US7851831B2TransistorMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Dec 14, 2010·7 cites·19 claims
- 0372US8008667B2Semiconductor device including a transparent semiconductor layer for viewing an underlying transistor in a semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Aug 30, 2011·4 cites·8 claims
- 0471US9355937B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 31, 2016·3 cites·11 claims
- 0569US8524601B2Method of manufacturing semiconductor device using Resolution Enhanced Lithography Assisted Chemical Shrinkage (RELACS)KURAHASHI KENICHIRO·Filed 2011·Granted Sep 3, 2013·5 cites·8 claims
- 0667US9159654B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Oct 13, 2015·2 cites·5 claims
- 0753US8878333B2Semiconductor device having improved RF characteristics and moisture resistance and method for manufacturing the sameNOGAMI YOUICHI·Filed 2012·Granted Nov 4, 2014·1 cites·4 claims
- 0849US12396904B2Absorbent articleDAIO SEISHI KK·Filed 2021·Granted Aug 26, 2025·0 cites·5 claims
- 0948US9117896B2Semiconductor device with improved conductivityMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 25, 2015·0 cites·7 claims
- 1043US2021059875A1Absorbent body, method for manufacturing same, and absorbent articleDAIO SEISHI KK·Filed 2019·Application pending·0 cites
- 1142US11538921B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 27, 2022·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Hidetoshi Koyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →