Inventor · disambiguated record
Hiroo Koyanagi
Also filed as: KOYANAGI HIROO
7 granted patents·5 pending applications·54 citations·filing 2000–2006
83Inventor score
Top patents by PatentIndex Score
12 records- 0184US6716892B1Urethane oligomer, resin compositions thereof, and cured article thereofNIPPON KAYAKU KK·Filed 2000·Granted Apr 6, 2004·25 cites·15 claims
- 0282US8080319B2Thermosetting resin composition and use thereofTANAKA RYUTARO·Filed 2006·Granted Dec 20, 2011·8 cites·17 claims
- 0363US7374862B2Photosensitive resin composition and curing product thereofNIPPON KAYAKU KK·Filed 2004·Granted May 20, 2008·7 cites·22 claims
- 0460US7678433B2Sealant for liquid crystal and liquid-crystal display cell made with the sameNIPPON KAYAKU KK·Filed 2004·Granted Mar 16, 2010·8 cites·11 claims
- 0552US7169829B2Maleimido-bearing compounds resin composition containing the same and cured articles thereofNIPPON KAYAKU KK·Filed 2002·Granted Jan 30, 2007·2 cites·8 claims
- 0647US7863345B2Process for producing microparticulate hardening catalystNIPPON KAYAKU KK·Filed 2006·Granted Jan 4, 2011·0 cites·3 claims
- 0740US7361450B2Photosensitive resins, resin compositions and products of curing thereofNIPPON KAYAKU KK·Filed 2003·Granted Apr 22, 2008·4 cites·29 claims
- 0837US2007161100A1Photosensitive resin composition and cured product thereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 0937US2005004288A1Resin composition, composition for solder resist, and cured article obtained therefromFiled 2002·Application pending·0 cites
- 1036US2009042126A1Photosensitive resin composition and cured article thereofTANAKA RYUTARO·Filed 2006·Application pending·0 cites
- 1131US2008306180A1Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product ThereofAMISHIMA CHIKA·Filed 2004·Application pending·0 cites
- 1227US2008286688A1Photosensitive Resin Composition and Cured Product ThereofKOYANAGI HIROO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →