Inventor · disambiguated record
Hiroyuki Kozono
Also filed as: KOZONO HIROYUKI
16 granted patents·1 pending application·539 citations·filing 1993–2002
95Inventor score
Files withTOSHIBA KK17
Top patents by PatentIndex Score
17 records- 0195US6177718B1Resin-sealed semiconductor deviceTOSHIBA KK·Filed 1999·Granted Jan 23, 2001·219 cites·14 claims
- 0276US5619070ASemiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chipTOSHIBA KK·Filed 1996·Granted Apr 8, 1997·52 cites·5 claims
- 0371US6107689ASemiconductor deviceTOSHIBA KK·Filed 1997·Granted Aug 22, 2000·41 cites·36 claims
- 0469US5497031ASemiconductor device having semiconductor chip with backside electrodeTOSHIBA KK·Filed 1994·Granted Mar 5, 1996·41 cites·11 claims
- 0567US5796160AResin-sealed semiconductor deviceTOSHIBA KK·Filed 1997·Granted Aug 18, 1998·36 cites·4 claims
- 0666US5399904AArray type semiconductor device having insulating circuit boardTOSHIBA KK·Filed 1993·Granted Mar 21, 1995·36 cites·10 claims
- 0765US6496016B1Semiconductor device for use in evaluating integrated circuit deviceTOSHIBA KK·Filed 2000·Granted Dec 17, 2002·10 cites·4 claims
- 0860US5909054ASemiconductor device having a multiple-terminal integrated circuit formed on a circuit substrateTOSHIBA KK·Filed 1997·Granted Jun 1, 1999·25 cites·6 claims
- 0953US5910681AResin sealed semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 8, 1999·19 cites·2 claims
- 1053US5731632ASemiconductor device having a plastic packageTOSHIBA KK·Filed 1997·Granted Mar 24, 1998·19 cites·5 claims
- 1147US5532514AHigh frequency semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 2, 1996·15 cites·4 claims
- 1246US6608387B2Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrateTOSHIBA KK·Filed 2002·Granted Aug 19, 2003·2 cites·14 claims
- 1346US5420459AResin encapsulation type semiconductor device having an improved lead configurationTOSHIBA KK·Filed 1993·Granted May 30, 1995·16 cites·13 claims
- 1436US2003038366A1Three-dimensional semiconductor device having plural active semiconductor componentsTOSHIBA KK·Filed 2002·Application pending·0 cites
- 1532US5581123ASemiconductor device and its manufacturing methodTOSHIBA KK·Filed 1995·Granted Dec 3, 1996·3 cites·5 claims
- 1632US5561324ASemiconductor chip mounting sectorTOSHIBA KK·Filed 1995·Granted Oct 1, 1996·3 cites·3 claims
- 1730US5434450APGA package type semiconductor device having leads to be supplied with power source potentialTOSHIBA KK·Filed 1994·Granted Jul 18, 1995·2 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →