Inventor · disambiguated record
Hideo Kubo
Also filed as: KUBO HIDEO · SANDA FUMIO
35 granted patents·14 pending applications·385 citations·filing 2000–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0196US10212849B2Liquid immersion tank, and apparatus including liquid immersion tankFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·23 cites·8 claims
- 0296US10149408B2Liquid immersion bath for electronic deviceFUJITSU LTD·Filed 2017·Granted Dec 4, 2018·29 cites·16 claims
- 0396US10015905B2Immersion cooling device and seal tankFUJITSU LTD·Filed 2017·Granted Jul 3, 2018·24 cites·20 claims
- 0496US7007506B2Refrigeration system utilizing incomplete evaporation of refrigerant in evaporatorFUJITSU LTD·Filed 2004·Granted Mar 7, 2006·109 cites·8 claims
- 0592US9778709B2Evaporator, cooling device, and electronic apparatusFUJITSU LTD·Filed 2015·Granted Oct 3, 2017·6 cites·13 claims
- 0691US6888725B2Electronics device unitFUJITSU LTD·Filed 2003·Granted May 3, 2005·70 cites·15 claims
- 0789US10080308B2Immersion cooling apparatusFUJITSU LTD·Filed 2017·Granted Sep 18, 2018·6 cites·12 claims
- 0887US7477519B2Electronic component package including heat spreading memberFUJITSU LTD·Filed 2005·Granted Jan 13, 2009·17 cites·17 claims
- 0986US6748755B2Refrigeration system utilizing incomplete evaporation of refrigerant in evaporatorFUJITSU LTD·Filed 2000·Granted Jun 15, 2004·38 cites·7 claims
- 1084US10881019B2Cooling apparatusFUJITSU LTD·Filed 2019·Granted Dec 29, 2020·4 cites·14 claims
- 1184US8817470B2Electronic device and complex electronic deviceAOKI NOBUMITSU·Filed 2012·Granted Aug 26, 2014·11 cites·12 claims
- 1281US10225951B2Liquid immersion tank of electronic equipmentFUJITSU LTD·Filed 2017·Granted Mar 5, 2019·3 cites·4 claims
- 1378US11064631B2Liquid immersion cooling device and information processing apparatusFUJITSU LTD·Filed 2018·Granted Jul 13, 2021·2 cites·11 claims
- 1478US7997887B2Cutter deviceJAPAN STEEL WORKS LTD·Filed 2008·Granted Aug 16, 2011·4 cites·7 claims
- 1578US7999374B2Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the sameFUJITSU LTD·Filed 2009·Granted Aug 16, 2011·7 cites·9 claims
- 1673US7221571B2Package unit, printed board having the same, and electronic apparatus having the printed boardFUJITSU LTD·Filed 2006·Granted May 22, 2007·6 cites·19 claims
- 1772US9620435B2Evaporator, cooling device, and electronic deviceFUJITSU LTD·Filed 2015·Granted Apr 11, 2017·2 cites·25 claims
- 1869US9951999B2Cooling device and electronic equipmentFUJITSU LTD·Filed 2014·Granted Apr 24, 2018·2 cites·9 claims
- 1969US8953312B2Electronic device and casing for electronic deviceSHIMASAKI AKIRA·Filed 2012·Granted Feb 10, 2015·3 cites·17 claims
- 2069US7834443B2Semiconductor device with molten metal preventing memberFUJITSU LTD·Filed 2008·Granted Nov 16, 2010·4 cites·9 claims
- 2168US8264850B2Electronic device package with connection terminals including uneven contact surfacesSO TSUYOSHI·Filed 2009·Granted Sep 11, 2012·4 cites·8 claims
- 2268US2024125561A1Cooling deviceFUJITSU LTD·Filed 2023·Application pending·0 cites
- 2364US7872875B2Mounting board, height adjusting apparatus and mounting methodFUJITSU LTD·Filed 2007·Granted Jan 18, 2011·2 cites·7 claims
- 2462US11892246B2Cooling deviceFUJITSU LTD·Filed 2022·Granted Feb 6, 2024·0 cites·5 claims
- 2562US7105272B2Acid-degradable resin compositions containing ketene-aldehyde copolymerNIPPON SODA CO·Filed 2003·Granted Sep 12, 2006·7 cites·22 claims
- 2661US2025056765A1Cooling device and cooling systemFUJITSU LTD·Filed 2024·Application pending·0 cites
- 2757US2014071631A1Printed circuit board unitFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2856US12289860B2Liquid cooling moduleFUJITSU LTD·Filed 2023·Granted Apr 29, 2025·0 cites·10 claims
- 2950US7847045B2Acrylic acid-based polymer and method of producing the sameNIPPON SODA CO·Filed 2006·Granted Dec 7, 2010·0 cites·7 claims
- 3050US2010226102A1Printed circuit board unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3150US2023240046A1Heat sink and electronic apparatusFUJITSU LTD·Filed 2022·Application pending·0 cites
- 3249US12173966B2Cooling deviceFUJITSU LTD·Filed 2021·Granted Dec 24, 2024·0 cites·18 claims
- 3347US10098264B2Air-conditioning apparatusFUJITSU LTD·Filed 2016·Granted Oct 9, 2018·0 cites·3 claims
- 3447US8914958B2Method and apparatus for inserting a valve into a valve guideSHINOHARA TADAHIRO·Filed 2008·Granted Dec 23, 2014·2 cites·2 claims
- 3547US2022346278A1Cooling deviceFUJITSU LTD·Filed 2022·Application pending·0 cites
- 3647US2022307772A1Cooling deviceFUJITSU LTD·Filed 2021·Application pending·0 cites
- 3746US8421219B2Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the sameSO TSUYOSHI·Filed 2011·Granted Apr 16, 2013·0 cites·6 claims
- 3846US8309888B2Electronic apparatus, power control device for controlling a heater, and method of controlling power control deviceSO TSUYOSHI·Filed 2010·Granted Nov 13, 2012·0 cites·11 claims
- 3946US2018135920A1Heat exchanger, information processing device, and flat tube manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 4046US2022322564A1Cooling deviceFUJITSU LTD·Filed 2022·Application pending·0 cites
- 4144US9694433B2Method of joining cooling componentFUJITSU LTD·Filed 2016·Granted Jul 4, 2017·0 cites·4 claims
- 4244US2015055301A1Card-type electronic component cooling structure and electronic deviceFUJITSU LTD·Filed 2014·Application pending·0 cites
- 4343US2012216992A1Dew-condensation detecting apparatus, electronic equipment cooling system, and dew-condensation detecting methodSO TSUYOSHI·Filed 2011·Application pending·0 cites
- 4442US8067515B2Method of producing an acrylic acid-based polymerKUBO HIDEO·Filed 2010·Granted Nov 29, 2011·0 cites·5 claims
- 4541US7951887B2Process for producing a polymerNIPPON SODA CO·Filed 2004·Granted May 31, 2011·0 cites·7 claims
- 4641US2016309620A1Pump, cooling apparatus and electronic deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 4741US2012210776A1Condensation sensing device, electronic apparatus, and condensation sensing methodSO TSUYOSHI·Filed 2012·Application pending·0 cites
- 4840US9949402B2Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatusFUJITSU LTD·Filed 2016·Granted Apr 17, 2018·0 cites·16 claims
- 4934US2016327996A1Cooling module and electronic deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →