Inventor · disambiguated record
Hiroyuki Kumakura
Also filed as: KUMAKURA HIROYUKI
23 granted patents·4 pending applications·152 citations·filing 1994–2025
94Inventor score
Top patents by PatentIndex Score
27 records- 0191US6592783B2Anisotropic conductive adhesive filmSONY CHEMICALS CORP·Filed 2001·Granted Jul 15, 2003·48 cites·8 claims
- 0289US8444882B2Anisotropic conductive film and light emitting deviceKANISAWA SHIYUKI·Filed 2010·Granted May 21, 2013·18 cites·12 claims
- 0376US7341642B2Manufacturing method for electric deviceSONY CORP·Filed 2003·Granted Mar 11, 2008·20 cites·15 claims
- 0472US10701467B2Speaker and speaker mounting structureJVC KENWOOD CORP·Filed 2018·Granted Jun 30, 2020·2 cites·3 claims
- 0572US2025250466A1Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheetDEXERIALS CORP·Filed 2025·Application pending·0 cites
- 0669US6780898B2Adhesive compositionSONY CHEMICALS CORP·Filed 2001·Granted Aug 24, 2004·16 cites·4 claims
- 0765US12312514B2Method for manufacturing smart cardDEXERIALS CORP·Filed 2021·Granted May 27, 2025·0 cites·11 claims
- 0862US8092636B2Anisotropic conductive adhesiveKUMAKURA HIROYUKI·Filed 2008·Granted Jan 10, 2012·2 cites·10 claims
- 0962US2023287246A1Method for manufacturing joined body, joined body, and hot-melt adhesive sheetDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 1061US12418130B2Connection body and method for manufacturing connection bodyDEXERIALS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·12 claims
- 1161US7025852B2Connecting material and mounting method which uses sameSONY CHEMICALS CORP·Filed 2003·Granted Apr 11, 2006·9 cites·8 claims
- 1260US9271083B2Speaker magnetic circuitJVC KENWOOD CORP·Filed 2014·Granted Feb 23, 2016·1 cites·7 claims
- 1356US10715896B2Speaker and speaker mounting structureJVC KENWOOD CORP·Filed 2018·Granted Jul 14, 2020·0 cites·7 claims
- 1456US6452111B1Adhesives and adhesive filmsSONY CHEMICALS CORP·Filed 2001·Granted Sep 17, 2002·7 cites·8 claims
- 1553USRE45092EAnisotropic conductive adhesiveDEXERIALS CORP·Filed 2008·Granted Aug 26, 2014·0 cites·20 claims
- 1653US7901768B2Multilayer anisotropic conductive adhesive and connection structure using the sameSONY CORP·Filed 2004·Granted Mar 8, 2011·5 cites·4 claims
- 1752US8265332B2Speaker diaphragm and speakerKUMAKURA HIROYUKI·Filed 2010·Granted Sep 11, 2012·1 cites·14 claims
- 1851US7459046B2Film-shaped adhesive application apparatusSONY CORP·Filed 2006·Granted Dec 2, 2008·0 cites·6 claims
- 1951US6760969B2Method for connecting electrical componentsSONY CHEMICALS CORP·Filed 2001·Granted Jul 13, 2004·4 cites·1 claims
- 2049US8845849B2Anisotropic conductive adhesiveKUMAKURA HIROYUKI·Filed 2011·Granted Sep 30, 2014·0 cites·5 claims
- 2147US5452366ALoudspeakerKENWOOD CORP·Filed 1994·Granted Sep 19, 1995·19 cites·4 claims
- 2245US12114123B2Sound input-output control apparatus, sound input-output control method, and non-transitory computer-readable mediumJVCKENWOOD CORP·Filed 2022·Granted Oct 8, 2024·0 cites·7 claims
- 2345US6861655B2Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devicesSONY CHEMICALS CORP·Filed 2003·Granted Mar 1, 2005·0 cites·4 claims
- 2443US11402408B2Electrical characteristics inspection toolDEXERIALS CORP·Filed 2018·Granted Aug 2, 2022·0 cites·17 claims
- 2542US2003178147A1Film-shaped adhesive application apparatusSONY CHEMICALS CORP·Filed 2003·Application pending·0 cites
- 2640US12022252B2Sound input-output control apparatus, sound input-output control method, and non-transitory computer-readable mediumJVCKENWOOD CORP·Filed 2022·Granted Jun 25, 2024·0 cites·4 claims
- 2737US2001018228A1Connecting material and mounting method which uses sameSONY CHEMICALS CORP·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hiroyuki Kumakura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →