Inventor · disambiguated record
Hiroyoshi Kurihara
Also filed as: KURIHARA HIROYOSHI
12 granted patents·8 pending applications·5 citations·filing 2006–2022
81Inventor score
Files withMITSUI CHEMICALS TOHCELLO INC16MITSUI CHEMICALS ICT MATERIA INC2MITSUI CHEMICALS INC1RM TOHCELLO CO LTD1
Top patents by PatentIndex Score
20 records- 0179US12142522B2Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2020·Granted Nov 12, 2024·1 cites·4 claims
- 0273US10515839B2Method for manufacturing semiconductor deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Dec 24, 2019·2 cites·11 claims
- 0369US11848215B2Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2019·Granted Dec 19, 2023·1 cites·11 claims
- 0462US11034864B2Adhesive film having adhesive resin layers and method of manufacturing electronic apparatus using the adhesive filmMITSUI CHEMICALS TOHCELLO INC·Filed 2018·Granted Jun 15, 2021·1 cites·5 claims
- 0556US2022213349A1Adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2020·Application pending·0 cites
- 0651US12463080B2Back grinding adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS ICT MATERIA INC·Filed 2022·Granted Nov 4, 2025·0 cites·9 claims
- 0749US12444640B2Method for manufacturing electronic deviceMITSUI CHEMICALS ICT MATERIA INC·Filed 2022·Granted Oct 14, 2025·0 cites·7 claims
- 0849US2024290648A1Back grinding adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 0949US2024249967A1Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1049US2024258172A1Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1149US2024258152A1Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1249US2024258150A1Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1349US2024266203A1Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2022·Application pending·0 cites
- 1448US2009087783A1Original plate for lithography, and resin composition for photosensitive layer in original plate for lithographyMITSUI CHEMICALS INC·Filed 2006·Application pending·0 cites
- 1547US12106974B2Method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2020·Granted Oct 1, 2024·0 cites·9 claims
- 1643US12362221B2Method for manufacturing electronic deviceRM TOHCELLO CO LTD·Filed 2021·Granted Jul 15, 2025·0 cites·13 claims
- 1743US11840652B2Adhesive film and method for manufacturing electronic deviceMITSUI CHEMICALS TOHCELLO INC·Filed 2019·Granted Dec 12, 2023·0 cites·8 claims
- 1837US10662355B2Pressure-sensitive adhesive composition, process for producing same, and pressure-sensitive adhesive filmMITSUI CHEMICALS TOHCELLO INC·Filed 2016·Granted May 26, 2020·0 cites·8 claims
- 1937US10577438B2Polyfunctional polymer and method for producing sameMITSUI CHEMICALS TOHCELLO INC·Filed 2016·Granted Mar 3, 2020·0 cites·4 claims
- 2036US11482441B2Method for manufacturing semiconductor device by backgrinding semiconductor wafer using an adhesive filmMITSUI CHEMICALS TOHCELLO INC·Filed 2017·Granted Oct 25, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →