Inventor · disambiguated record
Hideyuki Kurimoto
Also filed as: KURIMOTO HIDEYUKI
4 granted patents·7 pending applications·46 citations·filing 2003–2017
76Inventor score
Top patents by PatentIndex Score
11 records- 0185US8866949B2Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information deviceYANO YUJI·Filed 2010·Granted Oct 21, 2014·11 cites·21 claims
- 0277US8649111B2Optical element, optical element module, electronic element module, and electronic information deviceYANO YUJI·Filed 2012·Granted Feb 11, 2014·4 cites·19 claims
- 0375US7052934B2Fabrication method of semiconductor deviceSHARP KK·Filed 2004·Granted May 30, 2006·24 cites·9 claims
- 0465US7619031B2Low heat storing thermoplastic resin composition and molding thereofTECHNO POLYMER CO LTD·Filed 2003·Granted Nov 17, 2009·7 cites·23 claims
- 0551US2008050663A1Laminate for laser markingTECHNO POLYMER CO LTD·Filed 2007·Application pending·0 cites
- 0644US2010079642A1Optical element wafer and method for manufacturing optical element wafer, optical element, optical element module, electronic element wafer module, electronic element module, and electronic information deviceSHARP KK·Filed 2009·Application pending·0 cites
- 0741US2008139707A1Multi-Color Coloring Laser Marking-Use Chromatic Color Colorant, Multi-Color Coloring Laser Marking-Use Composition And Molding Containing It, Multi-Color Making-Carrying Molding And Laser Marking MethodTECHNO POLYMER CO LTD·Filed 2005·Application pending·0 cites
- 0839US2010291354A1Laminate for Laser MarkingKAWAKAMI KAZUYOSHI·Filed 2006·Application pending·0 cites
- 0937US2004212086A1Semiconductor apparatus and production method thereofSHARP KK·Filed 2004·Application pending·0 cites
- 1036US2019339478A1Optical deviceSHARP KK·Filed 2017·Application pending·0 cites
- 1135US2019215997A1Optical component mounting device and method for manufacturing sensor deviceSHARP KK·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →