Inventor · disambiguated record
Hiroyuki Kurino
Also filed as: KURINO HIROYUKI
4 granted patents·2 pending applications·115 citations·filing 1995–2005
75Inventor score
Top patents by PatentIndex Score
6 records- 0186US5613296AMethod for concurrent formation of contact and via holesTEXAS INSTRUMENTS INC·Filed 1995·Granted Mar 25, 1997·101 cites·20 claims
- 0239US7303990B2Nickel-silicon compound forming method, semiconductor device manufacturing method, and semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Granted Dec 4, 2007·0 cites·24 claims
- 0337US5610100AMethod for concurrently forming holes for interconnection between different conductive layers and a substrate element or circuit element close to the substrate surfaceTEXAS INSTRUMENTS INC·Filed 1995·Granted Mar 11, 1997·9 cites·14 claims
- 0433US6093595AMethod of forming source and drain regions in complementary MOS transistorsTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 25, 2000·5 cites·8 claims
- 0531US2006057845A1Method of forming nickel-silicon compound, semiconductor device, and semiconductor device manufacturing methodSEMICONDUCTOR TECH ACAD RES CT·Filed 2005·Application pending·0 cites
- 0630US2004050319A1Nickel-silicon compound forming method, semiconductor device manufacturing method, and semiconductor deviceSEMICONDUCTOR TECH ACAD RES CT·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →