Inventor · disambiguated record
Hirofumi Makimoto
Also filed as: MAKIMOTO HIROFUMI
2 granted patents·1 pending application·31 citations·filing 2000–2004
60Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0173US6830958B2Method of making chip scale packageMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 14, 2004·27 cites·3 claims
- 0248US6399422B1Radiating plate structure and method for manufacturing semiconductor devices using the same structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 4, 2002·4 cites·4 claims
- 0333US2005093180A1Chip scale packaged semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →