Inventor · disambiguated record
Hiroki Maruo
Also filed as: MARUO HIROKI
20 granted patents·3 pending applications·90 citations·filing 2007–2018
92Inventor score
Top patents by PatentIndex Score
23 records- 0192US7829265B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureFUJIKURA LTD·Filed 2008·Granted Nov 9, 2010·29 cites·7 claims
- 0290US7642466B2Connection configuration for rigid substratesFUJIKURA LTD·Filed 2007·Granted Jan 5, 2010·16 cites·4 claims
- 0385US7974104B2Printed wiring board and connection configuration of the sameFUJIKURA LTD·Filed 2009·Granted Jul 5, 2011·13 cites·11 claims
- 0483US7964800B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureFUJIKURA LTD·Filed 2007·Granted Jun 21, 2011·10 cites·9 claims
- 0577US9237686B2Method and system for producing component mounting boardPANASONIC CORP·Filed 2013·Granted Jan 12, 2016·5 cites·6 claims
- 0676US9439335B2Electronic component mounting line and electronic component mounting methodPANASONIC CORP·Filed 2012·Granted Sep 6, 2016·5 cites·4 claims
- 0773US8673685B1Electronic component mounting line and electronic component mounting methodPANASONIC CORP·Filed 2012·Granted Mar 18, 2014·4 cites·8 claims
- 0870US8003892B2Print circuit substrate and connection configuration of the sameFUJIKURA LTD·Filed 2007·Granted Aug 23, 2011·4 cites·10 claims
- 0967US8345436B2Printed wiring board and connection configuration of the sameFUJIKURA LTD·Filed 2007·Granted Jan 1, 2013·3 cites·14 claims
- 1052US8851138B2Substrate backing device and substrate thermocompression-bonding deviceMARUO HIROKI·Filed 2011·Granted Oct 7, 2014·1 cites·10 claims
- 1150US9795036B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Oct 17, 2017·0 cites·10 claims
- 1249US10412834B2Mounting structure and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·8 claims
- 1349US9839143B2Electrode joining method, production method of electrode joined structurePANASONIC CORP·Filed 2013·Granted Dec 5, 2017·0 cites·8 claims
- 1447US10786876B2Mounting Method of a semiconductor device using a colored auxiliary joining agentPANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·6 claims
- 1547US8492657B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureKITADA TOMOFUMI·Filed 2010·Granted Jul 23, 2013·0 cites·3 claims
- 1647US8222531B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureKITADA TOMOFUMI·Filed 2010·Granted Jul 17, 2012·0 cites·2 claims
- 1747US2008251280A1Soldering structure between circuit boardsFUJIKURA LTD·Filed 2007·Application pending·0 cites
- 1844US10037960B2Connection structure and connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 31, 2018·0 cites·14 claims
- 1944US2015096651A1Auxiliary joining agent and method for producing the samePANASONIC IP MAN CO LTD·Filed 2013·Application pending·0 cites
- 2040US9125329B2Electronic component mounting line and electronic component mounting methodPANASONIC CORP·Filed 2012·Granted Sep 1, 2015·0 cites·4 claims
- 2139US10464153B2Connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Nov 5, 2019·0 cites·8 claims
- 2236US10412838B2Conductive particle, and connection material, connection structure, and connecting method of circuit memberPANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·6 claims
- 2334US2011223236A1Selegiline-containing adhesive preparationNITTO DENKO CORP·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →