Inventor · disambiguated record
Hiroyuki Mieda
Also filed as: MIEDA Hiroyuki
0 granted patents·10 pending applications·0 citations·filing 2021–2022
Top patents by PatentIndex Score
10 records- 0165US2025066651A1Adhesive resin compositionTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0265US2025215270A1Adhesive resin compositionTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0363US2025122412A1Adhesive resin compositionTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0461US2024110005A1Polyester resin composition, aqueous dispersion, coating composition, and coating filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 0560US2024124642A1Polyester resin composition, aqueous dispersion, coating composition, and coating filmTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0660US2024084127A1Polyester resin composition, aqueous dispersion, coating composition, and coating filmTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0759US2024166863A1Polyester resin composition, aqueous dispersion, coating composition, and coating filmTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0859US2025059321A1Aqueous dispersion composition containing polyester resinTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 0957US2024279390A1Polyester resin composition, aqueous dispersion, paint composition, and coating filmTOYOBO MC CORP·Filed 2022·Application pending·0 cites
- 1050US2023081425A1Polyurethane resin having good adhesiveness to substrate, and composition for adhesive, ink binder, or coating agent using the resinTOYO BOSEKI·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →