Inventor · disambiguated record
Hiroki Miyake
Also filed as: MIYAKE HIROKI
18 granted patents·7 pending applications·13 citations·filing 2015–2025
87Inventor score
Top patents by PatentIndex Score
25 records- 0184USD1056428SShoe soleASICS CORP·Filed 2022·Granted Jan 7, 2025·9 cites·1 claims
- 0274US12136654B2Method for manufacturing semiconductor deviceDENSO CORP·Filed 2023·Granted Nov 5, 2024·0 cites·5 claims
- 0373US10439515B2Power conversion deviceTOYOTA MOTOR CO LTD·Filed 2019·Granted Oct 8, 2019·1 cites·11 claims
- 0470US12237225B2Method for manufacturing semiconductor deviceDENSO CORP·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 0570US10605688B2Load cell input unitOMRON TATEISI ELECTRONICS CO·Filed 2016·Granted Mar 31, 2020·2 cites·8 claims
- 0665US2025149385A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 0763US9825123B2Schottky barrier diode and method for manufacturing the sameTOYOTA MOTOR CO LTD·Filed 2015·Granted Nov 21, 2017·1 cites·7 claims
- 0862US11757009B2Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·4 claims
- 0960US12369339B2Surface treatment method for gallium oxide-based semiconductor substrate and semiconductor deviceDENSO CORP·Filed 2022·Granted Jul 22, 2025·0 cites·5 claims
- 1060US2025279286A1Method of manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1158US2024304459A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1256US12027377B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2021·Granted Jul 2, 2024·0 cites·6 claims
- 1355US11862477B2Method for manufacturing semiconductor device having gallium oxide-based semiconductor layerDENSO CORP·Filed 2021·Granted Jan 2, 2024·0 cites·6 claims
- 1455US2024021681A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1551US12132123B2P-type gallium oxide semiconductor device with alternating layersDENSO CORP·Filed 2021·Granted Oct 29, 2024·0 cites·23 claims
- 1648US11699600B2Wafer processing apparatus and method for processing waferDENSO CORP·Filed 2021·Granted Jul 11, 2023·0 cites·14 claims
- 1748US10551242B2Signal processing device, control method of signal processing device, control program and recording mediumOMRON TATEISI ELECTRONICS CO·Filed 2016·Granted Feb 4, 2020·0 cites·8 claims
- 1847US10411588B2Power converter with trench and planar transistors to improve efficiencyTOYOTA MOTOR CO LTD·Filed 2018·Granted Sep 10, 2019·0 cites·5 claims
- 1947US10257000B2Signal processing device, control method thereof, control procedure and recording mediumOMRON TATEISI ELECTRONICS CO·Filed 2016·Granted Apr 9, 2019·0 cites·14 claims
- 2043US10840386B2Semiconductor apparatusTOYOTA MOTOR CO LTD·Filed 2017·Granted Nov 17, 2020·0 cites·7 claims
- 2141US2023359487A1Control device, non-transitory computer-readable medium, and control methodOMRON TATEISI ELECTRONICS CO·Filed 2020·Application pending·0 cites
- 2239US9735149B2Schottky barrier diodeTOYOTA MOTOR CO LTD·Filed 2016·Granted Aug 15, 2017·0 cites·4 claims
- 2335US9972674B2Schottky barrier diode and manufacturing method thereofTOYOTA MOTOR CO LTD·Filed 2015·Granted May 15, 2018·0 cites·4 claims
- 2435US2016300960A1Diode and method of manufacturing diodeTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
- 2534US2016336423A1Method of manufacturing silicon carbide semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →