Inventor · disambiguated record
Hiromasa Miyoshi
Also filed as: MIYOSHI HIROMASA
13 granted patents·5 pending applications·50 citations·filing 2000–2018
88Inventor score
Top patents by PatentIndex Score
18 records- 0175US6620344B2Copper particle clusters and powder containing the same suitable as conductive filler of conductive pasteDOWA MINING CO·Filed 2000·Granted Sep 16, 2003·13 cites·2 claims
- 0274US8673049B2Low-temperature sintered silver nanoparticle composition and electronic articles formed using the sameJABLONSKI GREGORY A·Filed 2010·Granted Mar 18, 2014·3 cites·16 claims
- 0373US10328534B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Jun 25, 2019·2 cites·15 claims
- 0472US7235119B2Copper particle clusters and powder containing the same suitable as conductive filler of conductive pasteDOWA MINING CO·Filed 2005·Granted Jun 26, 2007·2 cites·2 claims
- 0569US9662748B2Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding methodDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted May 30, 2017·1 cites·8 claims
- 0669US6875252B2Copper powder and process for producing copper powderDOWA MINING CO·Filed 2002·Granted Apr 5, 2005·15 cites·3 claims
- 0767US6923924B2Copper particle clusters and powder containing the same suitable as conductive filler of conductive pasteDOWA MINING CO·Filed 2003·Granted Aug 2, 2005·7 cites·8 claims
- 0863US2018331063A1Method for joining electronic part using a joining silver sheetDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 0962US6881240B2Copper powder for electrically conductive pasteDOWA MINING CO·Filed 2002·Granted Apr 19, 2005·7 cites·9 claims
- 1061US2016254243A1Joining silver sheet, method for manufacturing same, and method for joining electronic partDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Application pending·0 cites
- 1155US10543569B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 28, 2020·0 cites·20 claims
- 1254US9914845B2Fine silver particle dispersing solutionDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Mar 13, 2018·0 cites·10 claims
- 1344US11453053B2Joining material and joining method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Sep 27, 2022·0 cites·20 claims
- 1441US2016121435A1Metal paste for joining, joining method and joined bodyFURUKAWA MASASHI·Filed 2014·Application pending·0 cites
- 1540US10821558B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Nov 3, 2020·0 cites·7 claims
- 1639US2002117652A1Silver-dispersed copper powder, process for producing the powder and conductive paste utilizing the powderDOWA MINING CO·Filed 2000·Application pending·0 cites
- 1736US2001002558A1Copper powder and process for producing copper powderDOWA MINING CO·Filed 2000·Application pending·0 cites
- 1833US10903185B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 26, 2021·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Hiromasa Miyoshi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →