Inventor · disambiguated record
Hiroyuki Mori
Also filed as: AKAMATSU KAZUO · MORI HIROYUKI
305 granted patents·92 pending applications·3,112 citations·filing 1978–2025
99Inventor score
Files withIBM44SONY CORP40MITSUBISHI MATERIALS CORP29MUSASHI SEIMITSU KOGYO KK18TOYOTA CHUO KENKYUSHO KK16
Top patents by PatentIndex Score
397 records- 0198US11732329B2Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrateMITSUBISHI MATERIALS CORP·Filed 2020·Granted Aug 22, 2023·3 cites·11 claims
- 0297US5583679ALiquid crystal display with optical compensatory sheet having discotic molecules varyingly inclinedFUJI PHOTO FILM CO LTD·Filed 1995·Granted Dec 10, 1996·300 cites·23 claims
- 0394US7468289B2Solid-state imaging device and method for manufacturing the sameSONY CORP·Filed 2006·Granted Dec 23, 2008·19 cites·4 claims
- 0494US6801236B2Printing device and printing methodTOSHIBA KK·Filed 2002·Granted Oct 5, 2004·24 cites·4 claims
- 0593US11171167B2Solid-state imaging apparatus and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Nov 9, 2021·4 cites·20 claims
- 0693US9799992B2Socket, adaptor, and assembly jig wherein an imaging device and an object are sandwiched by base membersPANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 24, 2017·9 cites·11 claims
- 0793US9587730B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2016·Granted Mar 7, 2017·6 cites·19 claims
- 0893US6985362B2Printed circuit board and electronic package using sameIBM·Filed 2001·Granted Jan 10, 2006·70 cites·5 claims
- 0993US5443707AApparatus for electroplating the main surface of a substrateNEC CORP·Filed 1994·Granted Aug 22, 1995·160 cites·20 claims
- 1092US9783480B2Phenyl (meth)acrylate production method and phenyl (meth)acrylate compositionMITSUBISHI CHEM CORP·Filed 2016·Granted Oct 10, 2017·4 cites·10 claims
- 1192US9066433B2Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2012·Granted Jun 23, 2015·6 cites·16 claims
- 1292US8728847B2Solid-state imaging device and method for manufacturing the sameMARUYAMA YASUSHI·Filed 2012·Granted May 20, 2014·8 cites·6 claims
- 1392US7289008B2High-frequency module and communication apparatusKYOCERA CORP·Filed 2004·Granted Oct 30, 2007·78 cites·32 claims
- 1491US11574817B2Fabricating an interconnection using a sacrificial layerIBM·Filed 2021·Granted Feb 7, 2023·2 cites·14 claims
- 1591US10906750B2Article sorting facilityDAIFUKU KK·Filed 2019·Granted Feb 2, 2021·7 cites·13 claims
- 1691US10221928B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2016·Granted Mar 5, 2019·7 cites·11 claims
- 1791US8593202B2Ringing suppression circuitMORI HIROYUKI·Filed 2012·Granted Nov 26, 2013·20 cites·2 claims
- 1891US6972910B2Lens centering mechanism, lens apparatus and imaging apparatusSONY CORP·Filed 2005·Granted Dec 6, 2005·16 cites·1 claims
- 1990US12127342B2Metal base substrate, electronic component mounting substrateMITSUBISHI MATERIALS CORP·Filed 2021·Granted Oct 22, 2024·2 cites·4 claims
- 2090US10184503B2Fastening structureTOYOTA MOTOR CO LTD·Filed 2017·Granted Jan 22, 2019·7 cites·8 claims
- 2190US9252301B2Solar cell and method for manufacturing solar cellMORIGAMI MITSUAKI·Filed 2012·Granted Feb 2, 2016·18 cites·21 claims
- 2290US6669986B1Process for manufacturing multilayer pellets and use of the multilayer pelletsSUMIKA COLOR COMPANY LTD·Filed 2000·Granted Dec 30, 2003·83 cites·10 claims
- 2390US5829483AHoseTOYODA GOSEI KK·Filed 1995·Granted Nov 3, 1998·79 cites·3 claims
- 2489US11264314B2Interconnection with side connection to substrateIBM·Filed 2019·Granted Mar 1, 2022·6 cites·9 claims
- 2589US10301568B2Sliding systemTOYOTA MOTOR CO LTD·Filed 2017·Granted May 28, 2019·2 cites·8 claims
- 2689US9897188B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2015·Granted Feb 20, 2018·5 cites·20 claims
- 2789US8951369B2Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method of producing copper alloy for electronic/electric device, conductive component for electronic/electric device and terminalMITSUBISHI MATERIALS CORP·Filed 2013·Granted Feb 10, 2015·4 cites·28 claims
- 2889US8872953B2Solid-state imaging device, manufacturing method thereof, camera, and electronic deviceSAKANO YORITO·Filed 2010·Granted Oct 28, 2014·8 cites·8 claims
- 2989US5805253ALiquid crystal display with compensators having minimum retardations in the inclined directionFUJI PHOTO FILM CO LTD·Filed 1996·Granted Sep 8, 1998·103 cites·12 claims
- 3088US9863519B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2016·Granted Jan 9, 2018·4 cites·19 claims
- 3188US9661194B2Solid-state imaging device, manufacturing method thereof, camera, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2014·Granted May 23, 2017·6 cites·18 claims
- 3288US7521839B2Exciting method for elastic vibration member and vibratory driving deviceSONY CORP·Filed 2007·Granted Apr 21, 2009·18 cites·23 claims
- 3388US4989099AImage information reading apparatusTOSHIBA KK·Filed 1988·Granted Jan 29, 1991·65 cites·12 claims
- 3487US10006532B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2015·Granted Jun 26, 2018·4 cites·14 claims
- 3587US9903464B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2015·Granted Feb 27, 2018·4 cites·16 claims
- 3687US8547215B2Information presentation apparatus and systemSANMA NORIO·Filed 2010·Granted Oct 1, 2013·15 cites·30 claims
- 3787US6514352B2Cleaning method using an oxidizing agent, chelating agent and fluorine compoundTOKYO ELECTRON LTD·Filed 2001·Granted Feb 4, 2003·43 cites·18 claims
- 3887US6478035B1Cleaning device, cleaning system, treating device and cleaning methodTOKYO ELECTRON LTD·Filed 2000·Granted Nov 12, 2002·46 cites·14 claims
- 3987US5128785ALiquid crystal display device substantially free from cross-talk having varistor layers coupled to signal lines and picture electrodesUBE INDUSTRIES·Filed 1990·Granted Jul 7, 1992·84 cites·15 claims
- 4086US7671117B2Resin compositionSONY CORP·Filed 2007·Granted Mar 2, 2010·4 cites·6 claims
- 4186US7589137B2Resin composition and molded product obtained therefromSONY CORP·Filed 2006·Granted Sep 15, 2009·6 cites·7 claims
- 4286US6486414B2Through-hole structure and printed circuit board including the through-hole structureIBM·Filed 2001·Granted Nov 26, 2002·38 cites·30 claims
- 4385US10797011B2Method of forming solder bumpsIBM·Filed 2017·Granted Oct 6, 2020·3 cites·18 claims
- 4485US8890402B2Organic electroluminescence display deviceMORI HIROYUKI·Filed 2010·Granted Nov 18, 2014·9 cites·7 claims
- 4585US8124326B2Methods of patterning positive photoresistSHIRLEY PAUL D·Filed 2009·Granted Feb 28, 2012·10 cites·33 claims
- 4685US8119242B2Amorphous carbon film, process for forming amorphous carbon film, conductive member provided with amorphous carbon film, and fuel cell separatorISEKI TAKASHI·Filed 2007·Granted Feb 21, 2012·9 cites·50 claims
- 4784US11735575B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2021·Granted Aug 22, 2023·1 cites·16 claims
- 4884US11114308B2Controlling of height of high-density interconnection structure on substrateIBM·Filed 2018·Granted Sep 7, 2021·3 cites·24 claims
- 4984US11004819B2Prevention of bridging between solder jointsIBM·Filed 2019·Granted May 11, 2021·3 cites·14 claims
- 5084US9856972B2Differential deviceMUSASHI SEIMITSU KOGYO KK·Filed 2016·Granted Jan 2, 2018·3 cites·14 claims
Showing the top 50 of 397 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →