Inventor · disambiguated record
Hirosaku Nagano
Also filed as: NAGANO HIROSAKU
20 granted patents·304 citations·filing 1980–2004
95Inventor score
Top patents by PatentIndex Score
20 records- 0187US4742099APolyimide film and process for producing sameKANEGAFUCHI CHEMICAL IND·Filed 1986·Granted May 3, 1988·34 cites·4 claims
- 0284US4886874APolyimide having excellent thermal dimensional stabilityKANEGAFUCHI CHEMICAL IND·Filed 1988·Granted Dec 12, 1989·30 cites·13 claims
- 0379US5932345AThermally fusible adhesive copolymer, articles made therefrom, and method for producing the sameKANEGAFUCHI CHEMICAL IND·Filed 1996·Granted Aug 3, 1999·41 cites·19 claims
- 0476US7011905B2Solid polymer electrolyte membrane, solid polymer electrolyte fuel cell using the membrane and method of fabricating the sameKANEKA CORP·Filed 2004·Granted Mar 14, 2006·15 cites·22 claims
- 0576US5070181APolyimide filmKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Dec 3, 1991·28 cites·2 claims
- 0671US5081229APolyimide having excellent thermal dimensional stabilityKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Jan 14, 1992·29 cites·13 claims
- 0770US5668247AThermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wiresKANEGAFUCHI CHEMICAL IND·Filed 1993·Granted Sep 16, 1997·29 cites·15 claims
- 0869US5665802APolyimide film and manufacturing method thereofKANEGAFUCHI CHEMICAL IND·Filed 1996·Granted Sep 9, 1997·28 cites·19 claims
- 0964US6773809B1Copper foil with insulating adhesiveKANEKA CORP·Filed 2000·Granted Aug 10, 2004·10 cites·5 claims
- 1058US5621068AThermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminateKANEGAFUCHI CHEMICAL IND·Filed 1994·Granted Apr 15, 1997·21 cites·12 claims
- 1151US7252881B2Multilayer structure and multilayer wiring board using the sameKANEKA CORP·Filed 2001·Granted Aug 7, 2007·3 cites·26 claims
- 1251US5066770AProcess and apparatus for manufacturing polymersKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Nov 19, 1991·8 cites·12 claims
- 1350US5861192AMethod of improving adhesive property of polyimide film and polymidefilm having improved adhesive propertyKANEGAFUCHI CHEMICAL IND·Filed 1996·Granted Jan 19, 1999·11 cites·10 claims
- 1439US5167985AProcess for producing flexible printed circuit boardKANEGAFUCHI CHEMICAL IND·Filed 1990·Granted Dec 1, 1992·3 cites·2 claims
- 1539US4362826AHeat-resistant resin compositionKANEGAFUCHI CHEMICAL IND·Filed 1981·Granted Dec 7, 1982·4 cites·10 claims
- 1637US4387192AHeat resistant polyamide-imide resin from polycarboxylic acid-polyisocyanate modified with unsaturated monomerKANEGAFUCHI CHEMICAL IND·Filed 1980·Granted Jun 7, 1983·3 cites·2 claims
- 1734US5641852AThermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenolKANEGAFUCHI CHEMICAL IND·Filed 1996·Granted Jun 24, 1997·4 cites·2 claims
- 1832US4451621AHeat resistant resin composition comprising modified polyamide-imide resin having carboxyl groupsKANEGAFUCHI CHEMICAL IND·Filed 1982·Granted May 29, 1984·1 cites·2 claims
- 1930US5759693ALaminateKANEGAFUCHI CHEMICAL IND·Filed 1997·Granted Jun 2, 1998·0 cites·4 claims
- 2030US5026820AProcess for continuous mixing of a two-liquid curing type resinKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Jun 25, 1991·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →