Inventor · disambiguated record
Hideo Nagasawa
Also filed as: NAGASAWA HIDEO
18 granted patents·2 pending applications·91 citations·filing 1984–2020
92Inventor score
Top patents by PatentIndex Score
20 records- 0183US8804338B2Heat pipe docking systemNAGASAWA HIDEO·Filed 2010·Granted Aug 12, 2014·10 cites·14 claims
- 0277US4616942ARibbon cassette with re-inking mechanismNCR CO·Filed 1984·Granted Oct 14, 1986·22 cites·12 claims
- 0376US8917507B2Cooling device, electronic substrate and electronic deviceNAGASAWA HIDEO·Filed 2010·Granted Dec 23, 2014·4 cites·24 claims
- 0473US8801439B2Module socketSATO ERIKO·Filed 2012·Granted Aug 12, 2014·4 cites·12 claims
- 0570US8475181B2Capacitively coupled connector for flexible printed circuit applicationsNIITSU TOSHIHIRO·Filed 2009·Granted Jul 2, 2013·4 cites·12 claims
- 0670US7997913B2Card connector with double camMOLEX INC·Filed 2007·Granted Aug 16, 2011·6 cites·19 claims
- 0766US9106006B2Connector having an anisotropic conductive filmMOLEX INC·Filed 2013·Granted Aug 11, 2015·5 cites·9 claims
- 0864US4781477ADot matrix print headNCR CO·Filed 1987·Granted Nov 1, 1988·14 cites·18 claims
- 0959US9270042B2Card connectorNAITO YUJI·Filed 2011·Granted Feb 23, 2016·1 cites·15 claims
- 1058US9167722B2Electronic device provided with socket for card-shaped componentNAGASAWA HIDEO·Filed 2011·Granted Oct 20, 2015·1 cites·19 claims
- 1157US11233305B2Waveguide comprising a conductor layer formed on a resin tube including fittings held by the resin tube and a method for forming the waveguideMOLEX LLC·Filed 2020·Granted Jan 25, 2022·0 cites·9 claims
- 1250US11157197B2Socket interconnector for high pad count memory cardsWESTERN DIGITAL TECH INC·Filed 2019·Granted Oct 26, 2021·0 cites·17 claims
- 1341US4832516ADot matrix print headNCR CO·Filed 1988·Granted May 23, 1989·5 cites·6 claims
- 1441US4758105ARibbon cassette with guide mechanismNCR CO·Filed 1986·Granted Jul 19, 1988·4 cites·3 claims
- 1541US2022140510A1Card retaining member and card connector setMOLEX LLC·Filed 2020·Application pending·0 cites
- 1640US4787760ADot matrix print headNCR CO·Filed 1987·Granted Nov 29, 1988·4 cites·15 claims
- 1739US2011021052A1Stacked fpc connectorMOLEX INC·Filed 2007·Application pending·0 cites
- 1838US9057565B2Cooling device and electronic deviceNAGASAWA HIDEO·Filed 2010·Granted Jun 16, 2015·0 cites·20 claims
- 1935US6077735AMethod of manufacturing semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1996·Granted Jun 20, 2000·6 cites·7 claims
- 2031US5200764APrint head assembly for use in an ultrasonic printerNCR CO·Filed 1992·Granted Apr 6, 1993·1 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →