Inventor · disambiguated record
Hiroyuki Nagatomo
Also filed as: NAGATOMO HIROYUKI
7 granted patents·4 pending applications·23 citations·filing 1995–2024
77Inventor score
Top patents by PatentIndex Score
11 records- 0173US9899113B2Production method of scintillator dual arrayHITACHI METALS LTD·Filed 2013·Granted Feb 20, 2018·3 cites·12 claims
- 0269US7505646B2Optical switch and optical switch arrayHITACHI METALS LTD·Filed 2006·Granted Mar 17, 2009·5 cites·14 claims
- 0362US2025196593A1Window structure of vehicleMAZDA MOTOR·Filed 2024·Application pending·0 cites
- 0462US2025196592A1Window structure of vehicleMAZDA MOTOR·Filed 2024·Application pending·0 cites
- 0558US5617391AOptical recording and reproducing systemHITACHI LTD·Filed 1995·Granted Apr 1, 1997·15 cites·6 claims
- 0650US10518818B2Vehicle body structure of vehicleMAZDA MOTOR·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 0748US2019318988A1Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing methodHITACHI METALS LTD·Filed 2019·Application pending·0 cites
- 0847US2016211205A1Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing methodHITACHI METALS LTD·Filed 2014·Application pending·0 cites
- 0946US10559509B2Insulating substrate and semiconductor device using sameHITACHI METALS LTD·Filed 2017·Granted Feb 11, 2020·0 cites·11 claims
- 1038US6775070B2Collimator lensHITACHI METALS LTD·Filed 2002·Granted Aug 10, 2004·0 cites·8 claims
- 1131US9773738B2Circuit substrate for semiconductor package with multiple circuit substrate units and semiconductor package thereforHITACHI METALS LTD·Filed 2015·Granted Sep 26, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →