Inventor · disambiguated record
Hideo Nakagoshi
Also filed as: NAKAGOSHI HIDEO
11 granted patents·4 pending applications·79 citations·filing 2000–2024
87Inventor score
Top patents by PatentIndex Score
15 records- 0197US10256195B2Module and method for manufacturing sameMURATA MANUFACTURING CO·Filed 2017·Granted Apr 9, 2019·57 cites·13 claims
- 0278US8492959B2Structure for bonding metal plate and piezoelectric body and bonding methodKITAYAMA HIROKI·Filed 2011·Granted Jul 23, 2013·4 cites·5 claims
- 0375US9113571B2Electronic component module and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2013·Granted Aug 18, 2015·4 cites·8 claims
- 0473US9414513B2Electronic component moduleMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·4 cites·19 claims
- 0566US9276194B2Bonding method for bonding metal plate and piezoelectric bodyMURATA MANUFACTURING CO·Filed 2013·Granted Mar 1, 2016·2 cites·7 claims
- 0659US12309932B2Electronic component module, sub-module, and method for manufacturing sameMURATA MANUFACTURING CO·Filed 2023·Granted May 20, 2025·0 cites·3 claims
- 0758US2024389234A1Circuit moduleMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0857US7624492B1Method for manufacturing electronic partsMURATA MANUFACTURING CO·Filed 2000·Granted Dec 1, 2009·6 cites·7 claims
- 0957US2024312856A1Electronic component package, circuit module and method for producing electronic component packageMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1054US8726494B2Holding jig for electronic partsKATSUBE AKIO·Filed 2009·Granted May 20, 2014·2 cites·10 claims
- 1152US2023230907A1Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the moduleMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1247US2023335451A1Electronic component packageMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1346US7928559B2Semiconductor device, electronic component module, and method for manufacturing semiconductor deviceMURATA MANUFACTURING CO·Filed 2008·Granted Apr 19, 2011·0 cites·4 claims
- 1441US10861683B2Vacuum deviceMURATA MANUFACTURING CO·Filed 2017·Granted Dec 8, 2020·0 cites·8 claims
- 1540US10559535B2High-frequency module and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2018·Granted Feb 11, 2020·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →