Inventor · disambiguated record
Hidefumi Nakamura
Also filed as: NAKAMURA HIDEFUMI
25 granted patents·27 pending applications·41 citations·filing 2007–2023
93Inventor score
Top patents by PatentIndex Score
52 records- 0195US11866808B2Method for manufacturing thixomolding materialSEIKO EPSON CORP·Filed 2021·Granted Jan 9, 2024·2 cites·5 claims
- 0295US10848016B2Magnetic powder dust core with entirely buried coil or magnetSEIKO EPSON CORP·Filed 2016·Granted Nov 24, 2020·13 cites·6 claims
- 0392US10675682B2Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered bodySEIKO EPSON CORP·Filed 2018·Granted Jun 9, 2020·5 cites·7 claims
- 0488US10299376B2Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2016·Granted May 21, 2019·3 cites·9 claims
- 0586US10682697B2Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered bodySEIKO EPSON CORP·Filed 2018·Granted Jun 16, 2020·2 cites·12 claims
- 0682US9597767B2Polishing media, method for producing polishing media, and polishing methodISHIGAMI HIDEKI·Filed 2012·Granted Mar 21, 2017·4 cites·6 claims
- 0781US9219218B2Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Dec 22, 2015·3 cites·18 claims
- 0878US9249292B2Composition for injection molding, sintered compact, and method for producing sintered compactSEIKO EPSON CORP·Filed 2012·Granted Feb 2, 2016·3 cites·19 claims
- 0972US9655698B2Blank material to be cut for dentistry, metal powder for powder metallurgy, metal frame for porcelain fusing for dentistry, and dental prosthesisSEIKO EPSON CORP·Filed 2015·Granted May 23, 2017·1 cites·16 claims
- 1070US9954160B2Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Apr 24, 2018·3 cites·14 claims
- 1170US9888987B2Dental blank to be machined, metal powder for powder metallurgy, dental metal frame for porcelain bonding, and dental prosthesisSEIKO EPSON CORP·Filed 2014·Granted Feb 13, 2018·2 cites·9 claims
- 1262US11548066B2Injection molding material for magnesium thixomoldingSEIKO EPSON CORP·Filed 2021·Granted Jan 10, 2023·0 cites·3 claims
- 1362US11014155B2Gear, deceleration device, robot, and moving objectSEIKO EPSON CORP·Filed 2017·Granted May 25, 2021·0 cites·12 claims
- 1462US2015000468A1Metal powder for powder metallurgy and sintered bodySEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 1560US2023226757A1Method Of Manufacturing Three-Dimensional Shaped Object And Three-Dimensional Shaped ObjectSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1659US11498123B2Metal powder for powder metallurgy, compound, granulated powder, sintered body, and ornamentSEIKO EPSON CORP·Filed 2015·Granted Nov 15, 2022·0 cites·9 claims
- 1758US11524337B2Powder for additive manufacturing, additively manufactured body, method for producing additively manufactured body, and method for producing metal sintered bodySEIKO EPSON CORP·Filed 2020·Granted Dec 13, 2022·0 cites·8 claims
- 1856US11148197B2Raw material for thixomolding, method for producing raw material for thixomolding, and molded bodySEIKO EPSON CORP·Filed 2018·Granted Oct 19, 2021·0 cites·11 claims
- 1956US10934607B2Titanium sintered body, ornament, and heat resistant componentSEIKO EPSON CORP·Filed 2017·Granted Mar 2, 2021·0 cites·9 claims
- 2056US10773302B2Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2017·Granted Sep 15, 2020·0 cites·12 claims
- 2155US12240059B2Device for manufacturing three-dimensional shaped object and method for manufacturing three-dimensional shaped objectSEIKO EPSON CORP·Filed 2019·Granted Mar 4, 2025·0 cites·3 claims
- 2254US11332811B2Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2019·Granted May 17, 2022·0 cites·1 claims
- 2353US2021069780A1Precipitation hardening stainless steel powder, compound, granulated powder, precipitation hardening stainless steel sintered body, and method for producing precipitation hardening stainless steel sintered bodySEIKO EPSON CORP·Filed 2020·Application pending·0 cites
- 2452US2021154737A1Three-dimensional printing alloy powderSEIKO EPSON CORP·Filed 2020·Application pending·0 cites
- 2551US10130449B2Dental casting billet material, metal powder for powder metallurgy, dental metal component, and dental prosthesisSEIKO EPSON CORP·Filed 2015·Granted Nov 20, 2018·0 cites·7 claims
- 2651US2015104346A1Laser sintering powder, method for producing structure, apparatus for producing structureSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 2749US9309383B2Composition for injection molding, sintered compact, and method for producing sintered compactSEIKO EPSON CORP·Filed 2012·Granted Apr 12, 2016·0 cites·12 claims
- 2849US2015114178A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 2949US2013256957A1Translucent alumina and method for producing translucent aluminaSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 3047US9769934B2Package base, package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Granted Sep 19, 2017·0 cites·12 claims
- 3147US2011314965A1Metal powder for powder metallurgy and sintered bodyNAKAMURA HIDEFUMI·Filed 2011·Application pending·0 cites
- 3247US2007231181A1Method of manufacturing sintered bodySEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 3346US9045632B2Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection moldingSEIKO EPSON CORP·Filed 2012·Granted Jun 2, 2015·0 cites·20 claims
- 3446US2017291220A1Metal powder for powder metallurgy, compound, granulated powder, sintered body, and heat resistant componentSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 3545US2017192392A1OrnamentSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 3644US2016194740A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3744US2016228948A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 3844US2017241287A1Metal powder for powder metallurgy, compound, granulated powder, sintered body, and heat resistant componentSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 3944US2016222496A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 4044US2018147627A1Powder for energy beam sintering, method for producing powder for energy beam sintering, and method for producing sintered bodySEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 4143US2017067137A1Titanium sintered body and ornamentSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 4243US2016199912A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 4343US2016168671A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4442US2015252459A1Metal powder for powder metallurgy, compound, granulated powder, and sintered bodySEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4541US2015070855A1Circuit board, method for manufacturing circuit board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 4641US2015273581A1Metal powder for powder metallurgy, compound, granulated powder, sintered body, and method for producing sintered bodySEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4740US2015216637A1Dental component, metal powder for powder metallurgy, and method for producing dental componentSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 4840US2017043400A1Sintered body production method, degreased body production method, and heating furnaceSEIKO EPSON CORP·Filed 2016·Application pending·0 cites
- 4939US2015217371A1Manufacturing method of compact, manufacturing method of structure, and cutting processed materialSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
- 5038US9073121B2Method for producing sintered compactNAKAMURA HIDEFUMI·Filed 2011·Granted Jul 7, 2015·0 cites·8 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →