Inventor · disambiguated record
Hiroyuki Nakao
Also filed as: NAKAO HIROYUKI
7 granted patents·6 pending applications·52 citations·filing 1989–2022
81Inventor score
Files withMITSUBISHI CHEM CORP6MITSUBISHI ELECTRIC CORP3FURUNO ELECTRIC CO1KIRIYAMA TAKAYUKI1MITSUBISHI RAYON CO1
Top patents by PatentIndex Score
13 records- 0193US12319017B2Method for manufacturing SMCMITSUBISHI CHEM CORP·Filed 2022·Granted Jun 3, 2025·1 cites·18 claims
- 0277US2023139814A1Sheet molding compound, fiber-reinforced composite material, and method for producing fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
- 0371US2020131297A1Sheet molding compound, fiber-reinforced composite material, and method for producing fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2019·Application pending·0 cites
- 0470US9796590B2Carbon fiber manufacturing method and carbon fiberKIRIYAMA TAKAYUKI·Filed 2012·Granted Oct 24, 2017·2 cites·12 claims
- 0569US6741511B2Semiconductor memory deviceRENESAS TECH CORP·Filed 2002·Granted May 25, 2004·20 cites·11 claims
- 0669US5140177AComplementary circuit device returnable to normal operation from latch-up phenomenonMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Aug 18, 1992·18 cites·12 claims
- 0762US12270148B2Sizing agent, reinforcement fiber tow, fiber-reinforced resin-molding material, and fiber-reinforced composite materialMITSUBISHI CHEM CORP·Filed 2020·Granted Apr 8, 2025·0 cites·21 claims
- 0855US9890481B2Method for production of carbon fiber bundleMITSUBISHI CHEM CORP·Filed 2013·Granted Feb 13, 2018·0 cites·16 claims
- 0951US2020087469A1Fiber-reinforced molding material and molded articleMITSUBISHI CHEM CORP·Filed 2019·Application pending·0 cites
- 1045US2015274860A1Flame-resistant fiber bundle, carbon fiber bundle, and processes for producing theseMITSUBISHI RAYON CO·Filed 2012·Application pending·0 cites
- 1143US5896342ASemiconductor memory device having collective writing mode for writing data on row basisMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 20, 1999·11 cites·12 claims
- 1234US2003189263A1Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1331US2015022398A1Method and program of detecting positioning signals, positioning signal reception device, positioning apparatus and information equipment terminalFURUNO ELECTRIC CO·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →